100331WFQMLV
vs
HD100150F
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
HITACHI LTD
|
Package Description |
QFF, QFL24,.4SQ
|
QFF, QFL24,.4SQ
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
100K
|
100K
|
JESD-30 Code |
S-GQFP-F24
|
S-CQFP-F24
|
JESD-609 Code |
e0
|
e0
|
Logic IC Type |
D FLIP-FLOP
|
D LATCH
|
Max Frequency@Nom-Sup |
400000000 Hz
|
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
1
|
6
|
Number of Functions |
3
|
1
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QFF
|
QFF
|
Package Equivalence Code |
QFL24,.4SQ
|
QFL24,.4SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK
|
Peak Reflow Temperature (Cel) |
260
|
|
Power Supply Current-Max (ICC) |
130 mA
|
159 mA
|
Prop. Delay@Nom-Sup |
2.5 ns
|
|
Propagation Delay (tpd) |
2.4 ns
|
1.5 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-PRF-38535 Class V
|
|
Seated Height-Max |
2.159 mm
|
2.38 mm
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
MILITARY
|
OTHER
|
Terminal Finish |
Tin/Lead (Sn63Pb37)
|
TIN LEAD
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Trigger Type |
POSITIVE EDGE
|
LOW LEVEL
|
fmax-Min |
400 MHz
|
|
Base Number Matches |
2
|
1
|
Part Package Code |
|
QFP
|
Pin Count |
|
24
|
Additional Feature |
|
WITH DUAL LATCH ENABLE
|
Length |
|
9.78 mm
|
Load Capacitance (CL) |
|
3 pF
|
Output Characteristics |
|
OPEN-EMITTER
|
Width |
|
9.78 mm
|
|
|
|
Compare 100331WFQMLV with alternatives
Compare HD100150F with alternatives