100125DC vs 100325MW8 feature comparison

100125DC National Semiconductor Corporation

Buy Now Datasheet

100325MW8 Rochester Electronics LLC

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP ROCHESTER ELECTRONICS LLC
Package Description DIP, DIP24,.4 DIE,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Delay-Max 4 ns 4.7 ns
Input Characteristics DIFFERENTIAL
Interface IC Type ECL TO TTL TRANSLATOR ECL TO TTL TRANSLATOR
JESD-30 Code R-GDIP-T24 X-XUUC-N
JESD-609 Code e0
Number of Bits 1 1
Number of Functions 6 6
Number of Terminals 24
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -55 °C
Output Characteristics TOTEM-POLE 3-STATE
Output Latch or Register NONE NONE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED UNSPECIFIED
Package Code DIP DIE
Package Equivalence Code DIP24,.4
Package Shape RECTANGULAR UNSPECIFIED
Package Style IN-LINE UNCASED CHIP
Qualification Status Not Qualified
Seated Height-Max 5.72 mm
Supply Current-Max 115 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Supply Voltage1-Max -5.7 V
Supply Voltage1-Min -4.2 V
Supply Voltage1-Nom -5 V
Surface Mount NO YES
Technology BIPOLAR ECL
Temperature Grade OTHER MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Width 10.16 mm
Base Number Matches 2 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare 100125DC with alternatives

Compare 100325MW8 with alternatives