Parametric results for: max4781ete under Multiplexers or Switches
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MAX4781ETE+
Maxim Integrated Products
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$2.7595 | Yes | Yes | Transferred | 1.8 V | YES | 2.5 Ω | 300 mΩ | 30 ns | 20 ns | 10 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 8 | 1 | 1 µA | 3.6 V | 1.6 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC16,.12SQ,20 | 16 | compliant | EAR99 | 8542.39.00.01 | ||||||
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MAX4781ETE+T
Maxim Integrated Products
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$2.8281 | Yes | Yes | Transferred | 1.8 V | YES | 2.5 Ω | 300 mΩ | 30 ns | 20 ns | 10 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 8 | 1 | 1 µA | 3.6 V | 1.6 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC16,.12SQ,20 | 16 | compliant | EAR99 | 8542.39.00.01 | ||||||
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MAX4781ETE+T
Analog Devices Inc
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$6.1041 | Yes | Active | 1.8 V | YES | 2.5 Ω | 300 mΩ | 30 ns | 20 ns | 10 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 8 | 1 | 1 µA | 3.6 V | 1.6 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | 16-LFCSP-3X3X0.75 | 16 | 16-LFCSP-3X3X0.75 | 2002-08-09 | Analog Devices | |||||||||
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MAX4781ETE
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 1.8 V | YES | 1 Ω | 300 mΩ | 25 ns | 15 ns | 10 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 8 | 1 | 75 dB | 1 µA | 3.6 V | 1.6 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 245 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 3 X 3 MM, 0.80 MM HEIGHT, MO-220, TQFN-16 | 16 | not_compliant | EAR99 | 8542.39.00.01 | ||||||
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MAX4781ETE
Rochester Electronics LLC
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Check for Price | No | No | Active | 1.8 V | YES | 1 Ω | 300 mΩ | 25 ns | 15 ns | SINGLE-ENDED MULTIPLEXER | CMOS | 8 | 1 | 75 dB | 3.6 V | 1.6 V | INDUSTRIAL | S-XQCC-N16 | e0 | 1 | 85 °C | -40 °C | 240 | 20 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | ROCHESTER ELECTRONICS LLC | QFN | 3 X 3 MM, 0.80 MM HEIGHT, MO-220, TQFN-16 | 16 | unknown | ||||||||||||
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MAX4781ETE+
Analog Devices Inc
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Check for Price | Yes | Active | 1.8 V | YES | 2.5 Ω | 300 mΩ | 30 ns | 20 ns | 10 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 8 | 1 | 1 µA | 3.6 V | 1.6 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | 16-LFCSP-3X3X0.75 | 16 | 16-LFCSP-3X3X0.75 | 2002-08-09 | Analog Devices | |||||||||
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MAX4781ETE-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 1.8 V | YES | 1 Ω | 300 mΩ | 25 ns | 15 ns | 10 mA | SINGLE-ENDED MULTIPLEXER | CMOS | 8 | 1 | 75 dB | 1 µA | 3.6 V | 1.6 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 3 X 3 MM, 0.80 MM HEIGHT, MO-220, TQFN-16 | 16 | not_compliant | 8542.39.00.01 |