Findchips: Parametric Search Results for MC7448THX1267ND


Select Parts		Part Number

		MC7448THX1267ND NXP Semiconductors
		MC7448THX1267ND Freescale Semiconductor
		MC7448THX1267ND Rochester Electronics LLC

				Most Relevant							Technical									Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Part Package Code	Pin Count

$438.3895

Obsolete

1.267 GHz

200 MHz

YES

1.05 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.1 V

1 V

INDUSTRIAL

S-CBGA-B360

Not Qualified

105 °C

-40 °C

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.8 mm

25 mm

NXP SEMICONDUCTORS

25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITC, CERAMIC, BGA-360

not_compliant

3A991.A.1

8542.31.00.01

NXP

$555.7947

Transferred

1.267 GHz

200 MHz

YES

1.05 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.1 V

1 V

INDUSTRIAL

S-CBGA-B360

Not Qualified

105 °C

-40 °C

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.8 mm

25 mm

FREESCALE SEMICONDUCTOR INC

25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITC, CERAMIC, BGA-360

not_compliant

3A991.A.1

8542.31.00.01

NXP

BGA

360

Check for Price

Active

1.267 GHz

200 MHz

YES

1.05 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.1 V

1 V

INDUSTRIAL

S-CBGA-B360

COMMERCIAL

105 °C

-40 °C

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

2.8 mm

25 mm

ROCHESTER ELECTRONICS LLC

25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITC, CERAMIC, BGA-360

unknown

BGA

360

Compare

MC7448THX1267ND

NXP Semiconductors

$438.3895

Obsolete

1.267 GHz

200 MHz

YES

1.05 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.1 V

1 V

INDUSTRIAL

S-CBGA-B360

Not Qualified

105 °C

-40 °C

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.8 mm

25 mm

NXP SEMICONDUCTORS

25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITC, CERAMIC, BGA-360

not_compliant

3A991.A.1

8542.31.00.01

NXP

MC7448THX1267ND

Freescale Semiconductor

$555.7947

Transferred

1.267 GHz

200 MHz

YES

1.05 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.1 V

1 V

INDUSTRIAL

S-CBGA-B360

Not Qualified

105 °C

-40 °C

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.8 mm

25 mm

FREESCALE SEMICONDUCTOR INC

25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITC, CERAMIC, BGA-360

not_compliant

3A991.A.1

8542.31.00.01

NXP

BGA

360

MC7448THX1267ND

Rochester Electronics LLC

Check for Price

Active

1.267 GHz

200 MHz

YES

1.05 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.1 V

1 V

INDUSTRIAL

S-CBGA-B360

COMMERCIAL

105 °C

-40 °C

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

2.8 mm

25 mm

ROCHESTER ELECTRONICS LLC

25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITC, CERAMIC, BGA-360

unknown

BGA

360

Parametric results for: MC7448THX1267ND under Microprocessors