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ISLA112P50IRZ
Renesas Electronics Corporation
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$148.3712 | Yes | Active | 1.8 V | 1.52 V | 1 | 0.048828 % | 12 | 500 MHz | 2 ns | YES | ADC, SUCCESSIVE APPROXIMATION | -1.52 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | SERIAL | S-PQCC-N72 | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 72 | PLASTIC/EPOXY | HVQCCN | LCC72,.39SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) - annealed | NO LEAD | 500 µm | QUAD | 10 mm | 850 µm | 10 mm | RENESAS ELECTRONICS CORP | QFN | HVQCCN, LCC72,.39SQ,20 | 72 | L72.10X10J | compliant | 3A001.A.5.A.3 | 8542.39.00.01 | Renesas Electronics | |||
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ISLA112P50IRZ
Intersil Corporation
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Check for Price | Transferred | 1.8 V | 1.52 V | 1 | 0.0488 % | 12 | 500 MHz | 2 µs | YES | ADC, SUCCESSIVE APPROXIMATION | 1.41 V | 1 | BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY | SAMPLE | CMOS | INDUSTRIAL | SERIAL | S-PQCC-N72 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 72 | PLASTIC/EPOXY | HVQCCN | LCC72,.39SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) - annealed | NO LEAD | 500 µm | QUAD | 10 mm | 850 µm | 10 mm | INTERSIL CORP | QFN | HVQCCN, LCC72,.39SQ,20 | 72 | compliant | 3A001.A.5.A.3 | 8542.39.00.01 |