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CGA3E1X5R1C105K080AC
TDK Corporation
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$0.0186 | Yes | Yes | Active | 1 µF | 16 V | 10 % | 0603 | X5R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | AEC-Q200 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||
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C1608X5R1C105K080AA
TDK Corporation
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$0.0216 | Yes | Yes | Active | 1 µF | 16 V | 10 % | 0603 | X5R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | , 0603 | compliant | EAR99 | 8532.24.00.20 | TDK | |||
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C1608X5R1A105K080AC
TDK Corporation
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$0.0238 | Yes | Yes | Not Recommended | 1 µF | 10 V | 10 % | 0603 | X5R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | , 0603 | compliant | EAR99 | 8532.24.00.20 | TDK | |||
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C1608X7R1C105K080AC
TDK Corporation
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$0.0281 | Yes | Yes | Active | 1 µF | 16 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | |||
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CGA3E1X7R1C105K080AC
TDK Corporation
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$0.0288 | Yes | Yes | Active | 1 µF | 16 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | AEC-Q200 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||
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C1608X5R1E105K080AC
TDK Corporation
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$0.0290 | Yes | Yes | Active | 1 µF | 25 V | 10 % | 0603 | X5R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | |||
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CGA3E2X5R1A105K080AA
TDK Corporation
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$0.0293 | Yes | Yes | Active | 1 µF | 10 V | 10 % | 0603 | X5R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | AEC-Q200 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||
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CGA3E3X7S1A225K080AB
TDK Corporation
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$0.0388 | Yes | Active | 2.2 µF | 10 V | 10 % | 0603 | X7S | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 22% ppm/°C | e3 | AEC-Q200 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | |||
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CGA3E1X7R1E105K080AC
TDK Corporation
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$0.0420 | Yes | Yes | Active | 1 µF | 25 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | AEC-Q200 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||
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C1608X5R1C225K080AB
TDK Corporation
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$0.0452 | Yes | Yes | Active | 2.2 µF | 16 V | 10 % | 0603 | X5R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK |