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1 - 10 of 129 results
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2N2907AUB
Microsemi Corporation
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$6.1862 | No | No | Transferred | 60 V | 600 mA | PNP | YES | SINGLE | 3 | 1 | 50 | 1.16 W | SWITCHING | SILICON | 300 ns | 45 ns | R-CDSO-N3 | e0 | Not Qualified | 200 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROSEMI CORP | SOT | HERMETIC SEALED, CERAMIC, CERSOT-3 | 3 | unknown | EAR99 | Microsemi Corporation | ||||
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JAN2N2907AUB
Microchip Technology Inc
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$6.5696 | No | Active | 60 V | 600 mA | PNP | YES | SINGLE | 3 | 1 | 100 | 400 mW | SWITCHING | SILICON | 300 ns | 45 ns | R-XDSO-N3 | e0 | Qualified | MIL-19500/291M | 200 °C | UNSPECIFIED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROCHIP TECHNOLOGY INC | SURFACE MOUNT PACKAGE-3 | compliant | EAR99 | Microchip | ||||||
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JANTX2N2907AUB
Microchip Technology Inc
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$6.8496 | No | Active | 60 V | 600 mA | PNP | YES | SINGLE | 3 | 1 | 100 | 400 mW | SWITCHING | SILICON | 300 ns | 45 ns | R-XDSO-N3 | e0 | Qualified | MIL-19500/291M | 200 °C | UNSPECIFIED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROCHIP TECHNOLOGY INC | SURFACE MOUNT PACKAGE-3 | compliant | EAR99 | Microchip | 8541.21.00.95 | |||||
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2N2907AUB
Microchip Technology Inc
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$6.8846 | No | Active | 60 V | 600 mA | PNP | YES | SINGLE | 3 | 1 | 50 | 1.16 W | SWITCHING | SILICON | 300 ns | 45 ns | R-CDSO-N3 | e0 | Not Qualified | 200 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, CERAMIC, CERSOT-3 | compliant | EAR99 | Microchip | |||||||
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JANTX2N2907AUB/TR
Microchip Technology Inc
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$7.0138 | Active | 60 V | 600 mA | PNP | YES | SINGLE | 3 | 1 | 100 | 400 mW | SWITCHING | SILICON | 300 ns | 45 ns | R-XDSO-N3 | e0 | Qualified | MIL-19500/291M | 200 °C | UNSPECIFIED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | Microchip | 8541.21.00.40 | |||||||
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2N2907AUB/TR
Microchip Technology Inc
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$7.0738 | No | Active | 60 V | 600 mA | PNP | YES | SINGLE | 3 | 1 | 50 | SWITCHING | SILICON | 300 ns | 45 ns | R-CDSO-N3 | e0 | Not Qualified | 200 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROCHIP TECHNOLOGY INC | CERAMIC PACKAGE-4 | compliant | EAR99 | Microchip | ||||||||
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JANTXV2N2907AUB
Microchip Technology Inc
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$8.4051 | No | Active | 60 V | 600 mA | PNP | YES | SINGLE | 3 | 1 | 100 | 400 mW | SWITCHING | SILICON | 300 ns | 45 ns | R-XDSO-N3 | e0 | Qualified | MIL-19500/291M | 200 °C | UNSPECIFIED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROCHIP TECHNOLOGY INC | SURFACE MOUNT PACKAGE-3 | compliant | EAR99 | Microchip | 8541.21.00.95 | |||||
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JANTXV2N2907AUB
Microsemi Corporation
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$8.9509 | No | No | Transferred | 60 V | 600 mA | PNP | YES | SINGLE | 3 | 1 | 100 | 400 mW | SWITCHING | SILICON | 300 ns | 45 ns | R-XDSO-N3 | e0 | Not Qualified | MIL-19500/291M | 200 °C | UNSPECIFIED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROSEMI CORP | SURFACE MOUNT PACKAGE-3 | 4 | not_compliant | EAR99 | Microsemi Corporation | ||||
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JANTX2N2907AUB
Microsemi Corporation
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$10.1660 | No | No | Transferred | 60 V | 600 mA | PNP | YES | SINGLE | 3 | 1 | 100 | 400 mW | SWITCHING | SILICON | 300 ns | 45 ns | R-XDSO-N3 | e0 | Not Qualified | MIL-19500/291M | 200 °C | UNSPECIFIED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROSEMI CORP | SURFACE MOUNT PACKAGE-3 | 3 | not_compliant | EAR99 | Microsemi Corporation | ||||
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JANTXV2N2907AUB/TR
Microchip Technology Inc
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$14.4477 | Active | 60 V | 600 mA | PNP | YES | SINGLE | 3 | 1 | 100 | 400 mW | SWITCHING | SILICON | 300 ns | 45 ns | R-XDSO-N3 | e0 | Qualified | MIL-19500/291M | 200 °C | UNSPECIFIED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | Microchip | 8541.21.00.40 |