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1 - 10 of 45 results
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2N2222AUBC
Microchip Technology Inc
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$29.5594 | No | Active | 50 V | 800 mA | NPN | YES | SINGLE | 3 | 1 | 30 | 500 mW | SWITCHING | SILICON | 300 ns | 35 ns | R-CDSO-N3 | e0 | Not Qualified | 200 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROCHIP TECHNOLOGY INC | CERAMIC PACKAGE-4 | compliant | EAR99 | Microchip | ||||||
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JANS2N2222AUBC
Microsemi Corporation
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$190.2698 | No | No | Transferred | 50 V | 800 mA | NPN | YES | SINGLE | 3 | 1 | 30 | 1 W | SWITCHING | SILICON | 300 ns | 35 ns | R-CDSO-N3 | e0 | Not Qualified | MIL-19500/255 | 200 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROSEMI CORP | CERAMIC PACKAGE-4 | unknown | EAR99 | Microsemi Corporation | 4 | |||
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JANS2N2222AUBC/TR
Microchip Technology Inc
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$204.8407 | Active | 50 V | 800 mA | NPN | YES | SINGLE | 3 | 1 | 30 | 1 W | SWITCHING | SILICON | 300 ns | 35 ns | R-CDSO-N3 | e0 | Qualified | MIL-19500/255 | 200 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROCHIP TECHNOLOGY INC | unknown | 9A604.X | Microchip | 8541.29.00.40 | ||||||
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JANS2N2222AUBC
Microchip Technology Inc
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$206.6513 | No | Active | 50 V | 800 mA | NPN | YES | SINGLE | 3 | 1 | 30 | 1 W | SWITCHING | SILICON | 300 ns | 35 ns | R-CDSO-N3 | e0 | Qualified | MIL-19500/255 | 200 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROCHIP TECHNOLOGY INC | CERAMIC PACKAGE-4 | compliant | 9A604.X | 8541.29.00.95 | |||||
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JANSR2N2222AUBC
Microchip Technology Inc
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$311.0288 | No | Active | 50 V | 800 mA | NPN | YES | SINGLE | 3 | 1 | 30 | SWITCHING | SILICON | 300 ns | 35 ns | R-CDSO-N3 | e0 | Qualified | MIL-19500/255 | 200 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | Tin/Lead (Sn/Pb) | NO LEAD | DUAL | MICROCHIP TECHNOLOGY INC | CERAMIC PACKAGE-4 | compliant | 9A604.X | Microchip | 8541.29.00.95 | |||||
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JANSH2N2222AUBC
Microchip Technology Inc
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$337.5425 | Yes | Active | 50 V | 800 mA | NPN | YES | SINGLE | 3 | 1 | 30 | 1 W | SWITCHING | SILICON | 300 ns | 35 ns | R-CDSO-N3 | e0 | Qualified | MIL-19500/255 | 200 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | Tin/Lead (Sn/Pb) | NO LEAD | DUAL | MICROCHIP TECHNOLOGY INC | CERAMIC PACKAGE-4 | compliant | 9A604.X | 8541.29.00.95 | |||||
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JANSH2N2222AUBC/TR
Microchip Technology Inc
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$337.7126 | Active | 50 V | 800 mA | NPN | YES | SINGLE | 3 | 1 | 30 | 1 W | SWITCHING | SILICON | 300 ns | 35 ns | R-CDSO-N3 | e0 | Qualified | MIL-19500/255 | 200 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | Tin/Lead (Sn/Pb) | NO LEAD | DUAL | MICROCHIP TECHNOLOGY INC | unknown | 9A604.X | 8541.29.00.40 | |||||||
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JANSP2N2222AUBC
Microsemi Corporation
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Check for Price | No | No | Obsolete | 50 V | 800 mA | NPN | YES | SINGLE | 3 | 1 | 30 | SWITCHING | SILICON | 300 ns | 35 ns | R-CDSO-N3 | Not Qualified | MIL-19500/255 | 200 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | NO LEAD | DUAL | MICROSEMI CORP | SMALL OUTLINE, R-CDSO-N3 | compliant | EAR99 | ||||||||
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MVR2N2222AUBCP
Microsemi Corporation
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Check for Price | Transferred | MICROSEMI CORP | compliant | EAR99 | ||||||||||||||||||||||||||||||||
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JANSL2N2222AUBC
Microsemi Corporation
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Check for Price | No | No | Transferred | 50 V | 800 mA | NPN | YES | SINGLE | 3 | 1 | 30 | SWITCHING | SILICON | 300 ns | 35 ns | R-CDSO-N3 | Not Qualified | MIL-19500/255 | 200 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | NO LEAD | DUAL | MICROSEMI CORP | CERAMIC PACKAGE-4 | compliant | EAR99 |