XC2V1500-5FGG676I vs XC2V1500-6FG676I feature comparison

XC2V1500-5FGG676I AMD Xilinx

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XC2V1500-6FG676I AMD Xilinx

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 27 X 27 MM, 1 MM PITCH, LEAD FREE, MS-034AAL-1, FBGA-676 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, FBGA-676
Pin Count 676 676
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 750 MHz 820 MHz
Combinatorial Delay of a CLB-Max 0.39 ns 0.35 ns
JESD-30 Code S-PBGA-B676 S-PBGA-B676
JESD-609 Code e1 e0
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1920 1920
Number of Equivalent Gates 1500000 1500000
Number of Inputs 392 392
Number of Logic Cells 17280 17280
Number of Outputs 392 392
Number of Terminals 676 676
Organization 1920 CLBS, 1500000 GATES 1920 CLBS, 1500000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA676,26X26,40 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 27 mm
Base Number Matches 1 1

Compare XC2V1500-5FGG676I with alternatives

Compare XC2V1500-6FG676I with alternatives