TMS320C6657GZH vs TMS320C6657CZHA feature comparison

TMS320C6657GZH Texas Instruments

Buy Now Datasheet

TMS320C6657CZHA Texas Instruments

Buy Now Datasheet
Part Life Cycle Code Obsolete Active
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description FBGA, 21 X 21 MM, GREEN, PLASTIC, BGA-625
Pin Count 625 625
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 24 24
Barrel Shifter NO NO
Boundary Scan YES YES
External Data Bus Width 16 16
Format FLOATING POINT FLOATING POINT
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PBGA-B625 S-PBGA-B625
Length 21 mm 21 mm
Low Power Mode YES YES
Number of Terminals 625 625
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA FBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Seated Height-Max 2.99 mm 2.99 mm
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 21 mm 21 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 9 3
Pbfree Code Yes
Rohs Code Yes
ECCN Code 5A991.B.1
Samacsys Manufacturer Texas Instruments
Bit Size 32
Integrated Cache YES
JESD-609 Code e1
Moisture Sensitivity Level 3
Number of DMA Channels 72
Number of Timers 8
On Chip Data RAM Width 8
On Chip Program ROM Width 8
Package Equivalence Code BGA625,25X25,32
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified
RAM (words) 8192
ROM Programmability MROM
Terminal Finish TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 30

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Compare TMS320C6657CZHA with alternatives