TLP552
vs
HCNW137
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TOSHIBA CORP
|
BROADCOM INC
|
| Package Description |
DIP-8
|
DIP-8
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8541.40.80.00
|
8541.40.80.00
|
| Samacsys Manufacturer |
Toshiba
|
Avago Technologies
|
| Additional Feature |
UL RECOGNIZED; OPEN COLLECTOR
|
UL RECOGNIZED, OPEN COLLECTOR
|
| Configuration |
COMPLEX
|
SINGLE
|
| Forward Current-Max |
0.02 A
|
0.02 A
|
| Isolation Voltage-Max |
2500 V
|
5000 V
|
| Number of Elements |
1
|
1
|
| Number of Functions |
1
|
1
|
| On-State Current-Max |
0.05 A
|
0.05 A
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Optoelectronic Device Type |
LOGIC IC OUTPUT OPTOCOUPLER
|
LOGIC IC OUTPUT OPTOCOUPLER
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Base Number Matches |
9
|
10
|
| Rohs Code |
|
No
|
| Factory Lead Time |
|
14 Weeks
|
| Data Rate-Nom |
|
10 MBps
|
| JESD-609 Code |
|
e0
|
| Mounting Feature |
|
THROUGH HOLE MOUNT
|
| Power Dissipation-Max |
|
0.085 W
|
| Response Time-Nom |
|
5e-8 ns
|
| Supply Voltage-Nom |
|
7 V
|
| Surface Mount |
|
NO
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare TLP552 with alternatives
Compare HCNW137 with alternatives