TJA1042T/1J vs TLE8250XSJ feature comparison

TJA1042T/1J NXP Semiconductors

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TLE8250XSJ Infineon Technologies AG

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Rohs Code Yes Yes
Part Life Cycle Code Not Recommended End Of Life
Ihs Manufacturer NXP SEMICONDUCTORS INFINEON TECHNOLOGIES AG
Part Package Code SOIC
Package Description 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8 SOP,
Pin Count 8
Manufacturer Package Code SOT96-1
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 10 Weeks
Samacsys Manufacturer NXP
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Length 4.9 mm 5 mm
Moisture Sensitivity Level 1 2A
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
Temperature Grade AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 3.9 mm 4 mm
Base Number Matches 1 2
Date Of Intro 2016-07-18
Screening Level AEC-Q100
Terminal Finish Nickel/Gold/Palladium (Ni/Au/Pd)

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