SGTL5000XNAA3/R2
vs
SGTL5000XNBA3R2
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFN
|
|
| Package Description |
HVQCCN,
|
QFN-32
|
| Pin Count |
32
|
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ALSO OPERATE WITH 1.1V TO 2V DIGITAL SUPPLY
|
|
| Filter |
YES
|
YES
|
| Input Type |
SINGLE-ENDED
|
|
| JESD-30 Code |
S-XQCC-N32
|
S-XQCC-N32
|
| JESD-609 Code |
e3
|
|
| Length |
5 mm
|
5 mm
|
| Linear Coding |
NOT AVAILABLE
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output |
VOLTAGE
|
VOLTAGE
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC32,.2SQ,20
|
LCC32,.2SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.9 mm
|
0.9 mm
|
| Supply Voltage-Nom |
1.8 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ADPCM CODEC
|
PROGRAMMABLE CODEC
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
5 mm
|
5 mm
|
| Base Number Matches |
2
|
1
|
| Factory Lead Time |
|
26 Weeks
|
| Samacsys Manufacturer |
|
NXP
|
|
|
|
Compare SGTL5000XNAA3/R2 with alternatives
Compare SGTL5000XNBA3R2 with alternatives