NCP5006SNT1
vs
FAN5343UMPX
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
FAIRCHILD SEMICONDUCTOR CORP
|
| Part Package Code |
TSOP
|
UMLP
|
| Package Description |
TSOP-5
|
2 X 2 MM, 0.55 MM HEIGHT, GREEN, MO-229, UMLP-6
|
| Pin Count |
5
|
6
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
onsemi
|
|
| Interface IC Type |
LED DISPLAY DRIVER
|
LED DISPLAY DRIVER
|
| JESD-30 Code |
R-PDSO-G5
|
S-PDSO-N6
|
| JESD-609 Code |
e0
|
e4
|
| Length |
3 mm
|
2 mm
|
| Multiplexed Display Capability |
NO
|
NO
|
| Number of Functions |
1
|
1
|
| Number of Segments |
1
|
6
|
| Number of Terminals |
5
|
6
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-25 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
HVSON
|
| Package Equivalence Code |
TSOP5/6,.11,37
|
SOLCC6,.08,25
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
235
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
0.55 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom |
3.6 V
|
3.6 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.95 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
1.5 mm
|
2 mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Manufacturer Package Code |
|
6LD,UMLP,DUAL,0.65 PITCH,PKG 2.0X2.0MM
|
| Moisture Sensitivity Level |
|
1
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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