MM74HC4050MX vs 5962-8682001EX feature comparison

MM74HC4050MX Fairchild Semiconductor Corporation

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5962-8682001EX Texas Instruments

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Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP TEXAS INSTRUMENTS INC
Part Package Code SOIC DIP
Package Description 0.150 INCH, MS-012, SOIC-16 DIP,
Pin Count 16 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CMOS-TTL LEVEL TRANSLATOR
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-GDIP-T16
JESD-609 Code e3
Length 9.9 mm 19.56 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Prop. Delay@Nom-Sup 20 ns 26 ns
Propagation Delay (tpd) 100 ns 130 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.75 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish MATTE TIN
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 3.9 mm 7.62 mm
Base Number Matches 2 1
Power Supply Current-Max (ICC) 0.04 mA
Screening Level MIL-STD-883
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MM74HC4050MX with alternatives

Compare 5962-8682001EX with alternatives