MM74HC4050MX vs 74HC4050D-Q100 feature comparison

MM74HC4050MX National Semiconductor Corporation

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74HC4050D-Q100 NXP Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Package Description PLASTIC, SO-16 3.90 MM, PLASTIC, MS-012, SOT109-1, SOP-16
Reach Compliance Code unknown unknown
Additional Feature WITH EXTENDED INPUT VOLTAGE
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 9.9 mm 9.9 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUFFER BUFFER
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 20 ns 130 ns
Qualification Status Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 4 2
Rohs Code Yes
Part Package Code SOIC
Pin Count 16
HTS Code 8542.39.00.01
JESD-609 Code e4
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Screening Level AEC-Q100
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED