MCP2515-E/P vs MCP2515-E/SORB4 feature comparison

MCP2515-E/P Microchip Technology Inc

Buy Now Datasheet

MCP2515-E/SORB4 Microchip Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes
Part Life Cycle Code Active Not Recommended
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code DIP
Package Description 0.300 INCH, LEAD FREE, PLASTIC, DIP-18 SOIC-18
Pin Count 18
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 6 Weeks
Samacsys Manufacturer Microchip
Address Bus Width
Boundary Scan NO NO
Bus Compatibility SPI SPI
Clock Frequency-Max 40 MHz 40 MHz
Communication Protocol SYNC; BIT ;BYTE SYNC; BIT ;BYTE
Data Encoding/Decoding Method NRZ NRZ
Data Transfer Rate-Max 0.125 MBps 0.125 MBps
External Data Bus Width
JESD-30 Code R-PDIP-T18 R-PDSO-G18
JESD-609 Code e3 e3
Length 22.86 mm 11.55 mm
Low Power Mode YES YES
Number of I/O Lines
Number of Serial I/Os 1 1
Number of Terminals 18 18
On Chip Data RAM Width 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP18,.3 SOP18,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
RAM (words) 14
Seated Height-Max 5.334 mm 2.65 mm
Supply Current-Max 10 mA 10 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish MATTE TIN MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.5 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, CAN SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 1
Screening Level TS 16949

Compare MCP2515-E/P with alternatives

Compare MCP2515-E/SORB4 with alternatives