MC74HC14AFELG
vs
SN54H20W
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ONSEMI
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
SOIC
|
|
| Package Description |
LEAD FREE, EIAJ, SO-14
|
DFP,
|
| Pin Count |
14
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Family |
HC/UH
|
TTL/H/L
|
| JESD-30 Code |
R-PDSO-G14
|
R-GDFP-F14
|
| JESD-609 Code |
e4
|
e0
|
| Length |
10.2 mm
|
9.21 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
INVERTER
|
NAND GATE
|
| Max I(ol) |
0.004 A
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
6
|
2
|
| Number of Inputs |
1
|
4
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SOP
|
DFP
|
| Package Equivalence Code |
SOP14,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
FLATPACK
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Prop. Delay@Nom-Sup |
22 ns
|
|
| Propagation Delay (tpd) |
110 ns
|
10 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
YES
|
|
| Seated Height-Max |
2.05 mm
|
2.03 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
5.275 mm
|
6.29 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MC74HC14AFELG with alternatives
Compare SN54H20W with alternatives