MC74HC03ADTR2 vs 74HC00PW-Q100 feature comparison

MC74HC03ADTR2 Motorola Mobility LLC

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74HC00PW-Q100 NXP Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code TSSOP TSSOP
Package Description TSSOP, TSSOP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 5 mm 5 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 36 ns 135 ns
Qualification Status Not Qualified
Seated Height-Max 1.2 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.4 mm 4.4 mm
Base Number Matches 1 2
Rohs Code Yes
JESD-609 Code e4
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Screening Level AEC-Q100
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MC74HC03ADTR2 with alternatives

Compare 74HC00PW-Q100 with alternatives