FT232BL-TRAY
vs
XR21B1411IL16
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD
|
EXAR CORP
|
Part Package Code |
QFP
|
QFN
|
Package Description |
LQFP, LCC32,.2SQ,20
|
HVQCCN, LCC16,.12SQ,20
|
Pin Count |
32
|
16
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
FTDI Chip
|
|
Address Bus Width |
|
|
Clock Frequency-Max |
6 MHz
|
48 MHz
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PQFP-G32
|
S-XQCC-N16
|
JESD-609 Code |
e3
|
|
Length |
7 mm
|
3 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
32
|
16
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
LQFP
|
HVQCCN
|
Package Equivalence Code |
QFP32,.35SQ,32
|
LCC16,.12SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
0.9 mm
|
Supply Voltage-Max |
5.25 V
|
5.25 V
|
Supply Voltage-Min |
4.35 V
|
4.4 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.8 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
7 mm
|
3 mm
|
uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
Base Number Matches |
1
|
1
|
Data Transfer Rate-Max |
|
12 MBps
|
|
|
|
Compare FT232BL-TRAY with alternatives
Compare XR21B1411IL16 with alternatives