FT232BL-TRAY
vs
ISP1122ABD
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
QFP
|
|
| Package Description |
LQFP, LCC32,.2SQ,20
|
QFP, QFP32,.35SQ,32
|
| Pin Count |
32
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
FTDI Chip
|
|
| Address Bus Width |
|
|
| Clock Frequency-Max |
6 MHz
|
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQFP-G32
|
S-PQFP-G32
|
| JESD-609 Code |
e3
|
e3
|
| Length |
7 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
QFP
|
| Package Equivalence Code |
QFP32,.35SQ,32
|
QFP32,.35SQ,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
|
| Supply Voltage-Max |
5.25 V
|
|
| Supply Voltage-Min |
4.35 V
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
7 mm
|
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
|
| Base Number Matches |
1
|
2
|
|
|
|
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