AM2940XC vs AM2940LMB feature comparison

AM2940XC AMD

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AM2940LMB Rochester Electronics LLC

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC ROCHESTER ELECTRONICS LLC
Part Package Code DIE
Package Description DIE, DIE OR CHIP QCCN,
Pin Count 28
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Clock Frequency-Max 17 MHz 16 MHz
External Data Bus Width 8 8
JESD-30 Code R-XUUC-N28 S-CQCC-N28
Number of Terminals 28 28
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Code DIE QCCN
Package Equivalence Code DIE OR CHIP
Package Shape RECTANGULAR SQUARE
Package Style UNCASED CHIP CHIP CARRIER
Qualification Status Not Qualified
Supply Current-Max 290 mA
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology TTL TTL
Temperature Grade COMMERCIAL MILITARY
Terminal Form NO LEAD NO LEAD
Terminal Position UPPER QUAD
uPs/uCs/Peripheral ICs Type BIT-SLICE PROCESSOR, DIRECT MEMORY ADDRESS GENERATOR BIT-SLICE PROCESSOR, DIRECT MEMORY ADDRESS GENERATOR
Base Number Matches 1 1
ECCN Code 3A001.A.2.C
Length 8.89 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 2.54 mm
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 8.89 mm

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