AM2940XC vs AM2940DC feature comparison

AM2940XC AMD

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AM2940DC Rochester Electronics LLC

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC ROCHESTER ELECTRONICS LLC
Part Package Code DIE
Package Description DIE, DIE OR CHIP DIP,
Pin Count 28
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Clock Frequency-Max 17 MHz 17 MHz
External Data Bus Width 8 8
JESD-30 Code R-XUUC-N28 R-GDIP-T28
Number of Terminals 28 28
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material UNSPECIFIED CERAMIC, GLASS-SEALED
Package Code DIE DIP
Package Equivalence Code DIE OR CHIP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Qualification Status Not Qualified
Supply Current-Max 290 mA
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
uPs/uCs/Peripheral ICs Type BIT-SLICE PROCESSOR, DIRECT MEMORY ADDRESS GENERATOR BIT-SLICE PROCESSOR, DIRECT MEMORY ADDRESS GENERATOR
Base Number Matches 1 1
Length 37.211 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 5.715 mm
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm

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