AM2940DC vs AM2940XC feature comparison

AM2940DC Rochester Electronics LLC

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AM2940XC AMD

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC ADVANCED MICRO DEVICES INC
Package Description DIP, DIE, DIE OR CHIP
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Clock Frequency-Max 17 MHz 17 MHz
External Data Bus Width 8 8
JESD-30 Code R-GDIP-T28 R-XUUC-N28
Length 37.211 mm
Number of Terminals 28 28
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material CERAMIC, GLASS-SEALED UNSPECIFIED
Package Code DIP DIE
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE UNCASED CHIP
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 5.715 mm
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm
uPs/uCs/Peripheral ICs Type BIT-SLICE PROCESSOR, DIRECT MEMORY ADDRESS GENERATOR BIT-SLICE PROCESSOR, DIRECT MEMORY ADDRESS GENERATOR
Base Number Matches 1 1
Part Package Code DIE
Pin Count 28
Package Equivalence Code DIE OR CHIP
Qualification Status Not Qualified
Supply Current-Max 290 mA

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