1N5819
vs
JANS1N5819-1
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Contact Manufacturer
|
Active
|
| Ihs Manufacturer |
SILITEK CORP
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.9 V
|
0.49 V
|
| JESD-609 Code |
e0
|
e0
|
| Non-rep Pk Forward Current-Max |
25 A
|
25 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Output Current-Max |
1 A
|
1 A
|
| Rep Pk Reverse Voltage-Max |
40 V
|
45 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
SCHOTTKY
|
SCHOTTKY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
HERMETIC SEALED PACKAGE-2
|
| Factory Lead Time |
|
32 Weeks
|
| Additional Feature |
|
HIGH RELIABILITY
|
| Application |
|
GENERAL PURPOSE
|
| Case Connection |
|
ISOLATED
|
| Diode Element Material |
|
SILICON
|
| JEDEC-95 Code |
|
DO-41
|
| JESD-30 Code |
|
O-LALF-W2
|
| Number of Terminals |
|
2
|
| Operating Temperature-Min |
|
-65 °C
|
| Package Body Material |
|
GLASS
|
| Package Shape |
|
ROUND
|
| Package Style |
|
LONG FORM
|
| Qualification Status |
|
Qualified
|
| Reference Standard |
|
MIL-PRF-19500; MIL-STD-750
|
| Reverse Current-Max |
|
50 µA
|
| Reverse Test Voltage |
|
45 V
|
| Terminal Form |
|
WIRE
|
| Terminal Position |
|
AXIAL
|
|
|
|
Compare 1N5819 with alternatives
Compare JANS1N5819-1 with alternatives