Part # | Manufacturer | Description | Stock | Price | Buy | |
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SIGC101T170R3X1SA1
DISTI #
SIGC101T170R3X1SA1
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Infineon Technologies AG | IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC101T170R3X1SA1) RoHS: Compliant Min Qty: 31 Package Multiple: 1 Container: Waffle Pack SIGC101T170R3X1SA1 Part Details | 0 | RFQ SIGC101T170R3X1SA1 Part Details |