Parametric results for: vf b3 under Flash Memories

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Package Code: VFBGA
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S29AL016J70BFI010
Cypress Semiconductor
$0.6765 Yes Transferred 16.7772 Mbit 16 16K,8K,32K,64K 1MX16 3 V 70 ns FLASH TOP BOOT BLOCK 8 TOP YES YES YES 1 1,2,1,31 1000000 1.0486 M ASYNCHRONOUS PARALLEL 3 V YES 5 µA 30 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B48 Not Qualified e1 3 85 °C -40 °C 260 40 48 PLASTIC/EPOXY VFBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL 800 µm BOTTOM 1 mm 8.15 mm 6.15 mm CYPRESS SEMICONDUCTOR CORP compliant EAR99 8542.32.00.51
S29AL016J70BFI010
Spansion
$0.7188 Yes Yes Transferred 16.7772 Mbit 16 16K,8K,32K,64K 1MX16 3 V 70 ns FLASH TOP BOOT BLOCK 8 TOP YES YES YES 1 1,2,1,31 1000000 1.0486 M ASYNCHRONOUS PARALLEL 3 V YES 5 µA 30 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B48 Not Qualified e1 3 85 °C -40 °C 260 40 48 PLASTIC/EPOXY VFBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1 mm 8.15 mm 6.15 mm SPANSION INC compliant EAR99 8542.32.00.51 BGA 8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FPBGA-48 48
S29AL008J70BFI010
Cypress Semiconductor
$1.6707 Yes Transferred 8.3886 Mbit 16 8K,4K,16K,32K 512KX16 3 V 70 ns FLASH TOP BOOT BLOCK 8 TOP YES YES YES 1 1,2,1,15 512000 524.288 k ASYNCHRONOUS PARALLEL 3 V YES 5 µA 12 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B48 Not Qualified e1 3 85 °C -40 °C 260 40 48 PLASTIC/EPOXY VFBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL 800 µm BOTTOM 1 mm 8.15 mm 6.15 mm CYPRESS SEMICONDUCTOR CORP compliant EAR99 8542.32.00.51
S29AL008J70BFI010
Infineon Technologies AG
$1.9200 Yes Not Recommended 8.3886 Mbit 16 8K,4K,16K,32K 512KX16 3 V 70 ns FLASH TOP BOOT BLOCK 8 TOP YES YES YES 1 1,2,1,15 512000 524.288 k ASYNCHRONOUS PARALLEL 3 V YES 5 µA 12 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B48 Not Qualified e1 3 85 °C -40 °C 260 40 48 PLASTIC/EPOXY VFBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1 mm 8.15 mm 6.15 mm INFINEON TECHNOLOGIES AG compliant Infineon
SST39VF200A-70-4C-MAQE
Microchip Technology Inc
$1.9600 Yes Active 2.0972 Mbit 16 2K 128KX16 3 V 70 ns FLASH YES YES YES 100 100000 Write/Erase Cycles 1 1 64 128000 131.072 k ASYNCHRONOUS 3-STATE PARALLEL 3 V 20 µA 30 µA 3.6 V 2.7 V CMOS COMMERCIAL YES NOR TYPE R-PBGA-B48 Not Qualified e1 3 70 °C 260 40 48 PLASTIC/EPOXY VFBGA BGA48,6X11,20 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 500 µm BOTTOM 730 µm 6 mm 4 mm MICROCHIP TECHNOLOGY INC compliant EAR99 8542.32.00.51 DSBGA 4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207CB-4, WFBGA-48 48
S29AL016J70BFI010
Infineon Technologies AG
$1.9772 Yes Not Recommended 16.7772 Mbit 16 16K,8K,32K,64K 1MX16 3 V 70 ns FLASH TOP BOOT BLOCK 8 TOP YES YES YES 1 1,2,1,31 1000000 1.0486 M ASYNCHRONOUS PARALLEL 3 V YES 5 µA 30 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B48 Not Qualified e1 3 85 °C -40 °C 260 40 48 PLASTIC/EPOXY VFBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1 mm 8.15 mm 6.15 mm INFINEON TECHNOLOGIES AG compliant Infineon
SST39VF401C-70-4C-MAQE
Microchip Technology Inc
$2.1150 Yes Active 4.1943 Mbit 16 8K,4K,16K,32K 256KX16 3 V 70 ns FLASH BOTTOM BOOT BLOCK BOTTOM YES YES YES 100 100000 Write/Erase Cycles 1 1 1,2,1,7 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 3 V YES 20 µA 30 µA 3.6 V 2.7 V CMOS COMMERCIAL YES NOR TYPE R-PBGA-B48 Not Qualified e1 3 70 °C 260 40 48 PLASTIC/EPOXY VFBGA BGA48,6X11,20 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 500 µm BOTTOM 730 µm 6 mm 4 mm MICROCHIP TECHNOLOGY INC compliant EAR99 8542.32.00.51 DSBGA 4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207CB-4, WFBGA-48 48 Microchip
SST39VF402C-70-4C-MAQE
Microchip Technology Inc
$2.1150 Yes Active 4.1943 Mbit 16 8K,4K,16K,32K 256KX16 3 V 70 ns FLASH TOP BOOT BLOCK TOP YES YES YES 100 100000 Write/Erase Cycles 1 1 1,2,1,7 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 3 V YES 20 µA 30 µA 3.6 V 2.7 V CMOS COMMERCIAL YES NOR TYPE R-PBGA-B48 Not Qualified e1 3 70 °C 260 40 48 PLASTIC/EPOXY VFBGA BGA48,6X11,20 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 500 µm BOTTOM 730 µm 6 mm 4 mm MICROCHIP TECHNOLOGY INC compliant 3A991.B.1.A 8542.32.00.51 DSBGA 4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207CB-4, WFBGA-48 48 Microchip
SST39LF402C-55-4C-MAQE
Microchip Technology Inc
$2.1150 Yes Active 4.1943 Mbit 16 8K,4K,16K,32K 256KX16 3.3 V 55 ns FLASH TOP BOOT BLOCK TOP YES YES YES 100 100000 Write/Erase Cycles 1 1 1,2,1,7 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 3.3 V YES 20 µA 30 µA 3.6 V 3 V CMOS COMMERCIAL YES NOR TYPE R-PBGA-B48 Not Qualified e1 3 70 °C 260 40 48 PLASTIC/EPOXY VFBGA BGA48,6X11,20 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 500 µm BOTTOM 730 µm 6 mm 4 mm MICROCHIP TECHNOLOGY INC compliant 3A991.B.1.A 8542.32.00.51 DSBGA 4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207CB-4, WFBGA-48 48 Microchip
SST39LF401C-55-4C-MAQE
Microchip Technology Inc
$2.1150 Yes Active 4.1943 Mbit 16 8K,4K,16K,32K 256KX16 3.3 V 55 ns FLASH BOTTOM BOOT BLOCK BOTTOM YES YES YES 100 100000 Write/Erase Cycles 1 1 1,2,1,7 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 3.3 V YES 20 µA 30 µA 3.6 V 3 V CMOS COMMERCIAL YES NOR TYPE R-PBGA-B48 Not Qualified e1 3 70 °C 260 40 48 PLASTIC/EPOXY VFBGA BGA48,6X11,20 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 500 µm BOTTOM 730 µm 6 mm 4 mm MICROCHIP TECHNOLOGY INC compliant 3A991.B.1.A 8542.32.00.51 DSBGA 4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207CB-4, WFBGA-48 48