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ADC1613S080HN/C1
Integrated Device Technology Inc
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Check for Price | Yes | Obsolete | 3 V | 2 V | 1 | 0.0076 % | 16 | 80 MHz | YES | ADC, PROPRIETARY METHOD | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE | TRACK | INDUSTRIAL | SERIAL | S-PQCC-N32 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.27SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN SILVER COPPER | NO LEAD | 650 µm | QUAD | 7 mm | 900 µm | 7 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFN | HVQCCN, | 32 | compliant | 3A991.C.4 | 8542.39.00.01 | |||||||||
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IDT75C58SB20P
Integrated Device Technology Inc
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Check for Price | No | Obsolete | 5 V | 100 mV | 1 | 0.3 % | 8 | 30 MHz | NO | ADC, FLASH METHOD | -1.9 V | -5.2 V | 1 | BINARY | CMOS | COMMERCIAL | PARALLEL, 8 BITS | R-PDIP-T28 | Not Qualified | e0 | 1 | 70 °C | 240 | 20 | 28 | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 15.24 mm | 4.699 mm | 36.576 mm | INTEGRATED DEVICE TECHNOLOGY INC | DIP | 0.600 INCH, PLASTIC, DIP-28 | 28 | not_compliant | 8542.39.00.01 | ||||||||
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ADC1413S065HN-C1
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | 2 V | 0.03 % | 14 | YES | ADC, PROPRIETARY METHOD | 1 | OFFSET BINARY | 1.8,3 V | CMOS | INDUSTRIAL | S-PQCC-N32 | Not Qualified | e1 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 32 | PLASTIC/EPOXY | QCCN | LCC32,.27SQ,25 | SQUARE | CHIP CARRIER | TIN SILVER COPPER | NO LEAD | 635 µm | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | VFQFPN | 7 X 7 MM, 0.80 MM HEIGHT, PLASTIC, SOT1152-1, HVQFN-32 | 32 | compliant | NDG32 | |||||||||||||||
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IDT75C58S30SO
Integrated Device Technology Inc
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Check for Price | No | Obsolete | 5 V | 100 mV | 1 | 0.1953 % | 8 | 40 MHz | YES | ADC, FLASH METHOD | -1.9 V | -5.2 V | 1 | BINARY | CMOS | COMMERCIAL | PARALLEL, 8 BITS | R-PDSO-G28 | Not Qualified | e0 | 3 | 70 °C | 225 | 30 | 28 | PLASTIC/EPOXY | SOP | SOP28,.5 | RECTANGULAR | SMALL OUTLINE | TIN LEAD | GULL WING | 1.27 mm | DUAL | 8.763 mm | 3.048 mm | 18.3642 mm | INTEGRATED DEVICE TECHNOLOGY INC | SOIC | SOIC-28 | 28 | not_compliant | 8542.39.00.01 | ||||||||
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ADC1010S080HN-C1
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | 3 V | 2 V | 10 | YES | ADC, PROPRIETARY METHOD | 1 | OFFSET BINARY | 3 V | CMOS | INDUSTRIAL | S-PQCC-N40 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 40 | PLASTIC/EPOXY | QCCN | LCC40,.24SQ,20 | SQUARE | CHIP CARRIER | Matte Tin (Sn) - annealed | NO LEAD | 500 µm | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | VFQFPN | 6 X 6 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT618-1, HVQFN-40 | 40 | compliant | NLG40 | ||||||||||||||
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IDT75C58S30P
Integrated Device Technology Inc
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Check for Price | No | Obsolete | 5 V | 100 mV | 1 | 0.1953 % | 8 | 40 MHz | NO | ADC, FLASH METHOD | -1.9 V | -5.2 V | 1 | BINARY | CMOS | COMMERCIAL | PARALLEL, 8 BITS | R-PDIP-T28 | Not Qualified | e0 | 1 | 70 °C | 240 | 20 | 28 | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 15.24 mm | 4.699 mm | 36.576 mm | INTEGRATED DEVICE TECHNOLOGY INC | DIP | 0.600 INCH, PLASTIC, DIP-28 | 28 | not_compliant | 8542.39.00.01 | ||||||||
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ADC1413S105HN/C1
Integrated Device Technology Inc
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Check for Price | Yes | Obsolete | 3 V | 2 V | 1 | 0.0305 % | 14 | 105 MHz | YES | ADC, PROPRIETARY METHOD | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE | TRACK | INDUSTRIAL | SERIAL | S-PQCC-N32 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.27SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN SILVER COPPER | NO LEAD | 650 µm | QUAD | 7 mm | 900 µm | 7 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFN | HVQCCN, | 32 | compliant | 3A991.C.3 | 8542.39.00.01 | |||||||||
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ADC1003S030TS-C18
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | ADC, RESISTANCE LADDER | OFFSET BINARY | e3 | 1 | 260 | 30 | MATTE TIN | INTEGRATED DEVICE TECHNOLOGY INC | SSOP | 28 | unknown | 8542.39.00.01 | PYR28 | |||||||||||||||||||||||||||||||||||
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ADC1010S125HN/C1,5
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | 3 V | 2 V | 1 | 0.039 % | 10 | YES | A/D CONVERTER | 1 | OFFSET BINARY | INDUSTRIAL | S-PQCC-N40 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 40 | PLASTIC/EPOXY | QCCN | LCC40,.24SQ,20 | SQUARE | CHIP CARRIER | MATTE TIN | NO LEAD | 500 µm | QUAD | NXP SEMICONDUCTORS | QCCN, LCC40,.24SQ,20 | compliant | 8542.39.00.01 | ||||||||||||||||||
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75MB58S20P
Integrated Device Technology Inc
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Check for Price | No | Obsolete | 5 V | 500 mV | 1 | 8 | NO | A/D CONVERTER | -5 V | 1 | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY | CMOS | COMMERCIAL | R-PDIP-T24 | Not Qualified | e0 | 70 °C | 24 | PLASTIC/EPOXY | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | Tin/Lead (Sn85Pb15) | THROUGH-HOLE | 2.54 mm | DUAL | INTEGRATED DEVICE TECHNOLOGY INC | DIP, DIP24,.6 | unknown | 8542.39.00.01 |