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uPs/uCs/Peripheral ICs Type: PROGRAMMABLE SoC
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CY8C624AAZI-S2D44
 Cypress Semiconductor 		$18.8743 Yes Transferred YES 1.8 V PROGRAMMABLE SoC CMOS 3.6 V 1.7 V R-PQFP-G128 85 °C -40 °C 128 PLASTIC/EPOXY LFQFP QFP128,.63X.87,20 RECTANGULAR FLATPACK, LOW PROFILE, FINE PITCH Pure Tin (Sn) GULL WING 500 µm QUAD 1.6 mm 14 mm 20 mm CYPRESS SEMICONDUCTOR CORP compliant
XCZU2CG-1LSBVA484I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B484 e1 4 100 °C -40 °C 250 30 484 PLASTIC/EPOXY FBGA BGA484,22X22,32 SQUARE GRID ARRAY, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 2.61 mm 19 mm 19 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU17EG-1LFFVD1760I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B1760 e1 4 100 °C -40 °C 245 30 1760 PLASTIC/EPOXY BGA BGA1760,42X42,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 3.71 mm 42.5 mm 42.5 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU7CG-2LFFVC1156I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B1156 100 °C -40 °C 1156 PLASTIC/EPOXY BGA BGA1156,34X34,40 SQUARE GRID ARRAY BALL 1 mm BOTTOM 3.51 mm 35 mm 35 mm XILINX INC compliant 8542.31.00.01 ,
XCZU9CG-2LFFVC900E
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS OTHER S-PBGA-B900 e1 4 110 °C 245 30 900 PLASTIC/EPOXY BGA BGA900,30X30,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 3.42 mm 31 mm 31 mm XILINX INC compliant 8542.31.00.01 2018-03-09
CY8C6248AZI-S2D14
 Cypress Semiconductor 		Check for Price Yes Transferred YES 1.8 V PROGRAMMABLE SoC CMOS 3.6 V 1.7 V R-PQFP-G128 85 °C -40 °C 128 PLASTIC/EPOXY LFQFP QFP128,.63X.87,20 RECTANGULAR FLATPACK, LOW PROFILE, FINE PITCH Pure Tin (Sn) GULL WING 500 µm QUAD 1.6 mm 14 mm 20 mm CYPRESS SEMICONDUCTOR CORP compliant
CY8C6245AZI-S3D62
 Cypress Semiconductor 		Check for Price Yes Transferred YES 1.8 V PROGRAMMABLE SoC CMOS 3.6 V 1.7 V S-PQFP-G100 85 °C -40 °C 100 PLASTIC/EPOXY LFQFP QFP100,.63SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH Pure Tin (Sn) GULL WING 500 µm QUAD 1.6 mm 14 mm 14 mm CYPRESS SEMICONDUCTOR CORP compliant 8542.31.00.01 5A992.C
XCZU2EG-1LSFVA625I
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS INDUSTRIAL S-PBGA-B625 e1 4 100 °C -40 °C 250 30 625 PLASTIC/EPOXY FBGA BGA625,25X25,32 SQUARE GRID ARRAY, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 3.43 mm 21 mm 21 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU5EG-2LFBVB900E
 AMD Xilinx 		Check for Price Yes Transferred CAN, I2C, SPI, UART YES 850 mV PROGRAMMABLE SoC CMOS OTHER S-PBGA-B900 e1 4 110 °C 900 PLASTIC/EPOXY BGA BGA900,30X30,40 SQUARE GRID ARRAY Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL 1 mm BOTTOM 2.88 mm 31 mm 31 mm XILINX INC compliant 8542.31.00.01 2018-03-09
XCZU5EG-1SFVC784I
 AMD Xilinx 		Check for Price Yes Transferred YES 850 mV PROGRAMMABLE SoC CMOS 876 mV 825 mV INDUSTRIAL R-PBGA-B784 e1 4 100 °C -40 °C 250 30 784 PLASTIC/EPOXY BGA BGA784,28X28,32 RECTANGULAR GRID ARRAY TIN SILVER COPPER BALL 800 µm BOTTOM 3.32 mm 23 mm 23 mm XILINX INC compliant 8542.39.00.01 FCBGA-784 5A002.A.4
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