Findchips: Parametric Search Results for mpc859 mpc866 hardware s

Parametric results for: mpc859 mpc866 hardware s under Microprocessors

Select parts from the table below to compare.

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Select Parts		Part Number

		MPC859TVR133A NXP Semiconductors
		MPC859TZP100 Motorola Mobility LLC
		MPC859PZP133 Freescale Semiconductor
		MPC859DSLVR66A NXP Semiconductors
		MPC859PZP133 Motorola Mobility LLC
		MPC859DSLZP66 Motorola Semiconductor Products
		MPC859DSLZP66 Motorola Mobility LLC
		MPC859DSLZP66A NXP Semiconductors
		MPC859DSLZP50A NXP Semiconductors
		935321141557 NXP Semiconductors

			Most Relevant							Technical										Compliance			Operating Conditions				Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Additional Feature	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Part Package Code	Pin Count

$52.8006

Yes

Obsolete

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

1.9 V

1.7 V

OTHER

S-PBGA-B357

Not Qualified

95 °C

245

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

NXP SEMICONDUCTORS

LEAD FREE, PLASTIC, BGA-357

compliant

3A991.A.2

8542.31.00.01

NXP

Check for Price

Transferred

100 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

REQUIRES 3.3V I/O SUPPLY

YES

FIXED POINT

YES

1.9 V

1.7 V

S-PBGA-B357

Not Qualified

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

MOTOROLA INC

BGA,

unknown

3A991.A.2

8542.31.00.01

BGA

357

Check for Price

Obsolete

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

1.9 V

1.7 V

S-PBGA-B357

Not Qualified

220

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

FREESCALE SEMICONDUCTOR INC

BGA,

not_compliant

5A991

8542.31.00.01

BGA

357

Check for Price

Yes

Obsolete

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

1.9 V

1.7 V

OTHER

S-PBGA-B357

Not Qualified

95 °C

245

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

NXP SEMICONDUCTORS

LEAD FREE, PLASTIC, BGA-357

compliant

3A991.A.2

8542.31.00.01

Check for Price

Transferred

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

1.9 V

1.7 V

S-PBGA-B357

Not Qualified

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

MOTOROLA INC

BGA,

unknown

8542.31.00.01

BGA

357

Check for Price

Transferred

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

REQUIRES 3.3V I/O SUPPLY

YES

FIXED POINT

YES

1.9 V

1.7 V

S-PBGA-B357

Not Qualified

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

MOTOROLA INC

BGA,

unknown

3A991.A.2

8542.31.00.01

Check for Price

Transferred

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

REQUIRES 3.3V I/O SUPPLY

YES

FIXED POINT

YES

1.9 V

1.7 V

S-PBGA-B357

Not Qualified

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

MOTOROLA INC

BGA,

unknown

3A991.A.2

8542.31.00.01

BGA

357

Check for Price

Obsolete

66 MHz

66.67 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

1.9 V

1.7 V

S-PBGA-B357

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

NXP SEMICONDUCTORS

BGA-357

unknown

3A991.A.2

8542.31.00.01

Check for Price

Obsolete

50 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

1.9 V

1.7 V

OTHER

S-PBGA-B357

Not Qualified

95 °C

220

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

NXP SEMICONDUCTORS

PLASTIC, BGA-357

unknown

3A991.A.2

8542.31.00.01

Check for Price

Obsolete

MICROPROCESSOR, RISC

245

TIN SILVER COPPER

NXP SEMICONDUCTORS

unknown

8542.31.00.01

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MPC859TVR133A

NXP Semiconductors

$52.8006

Yes

Obsolete

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

1.9 V

1.7 V

OTHER

S-PBGA-B357

Not Qualified

95 °C

245

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

NXP SEMICONDUCTORS

LEAD FREE, PLASTIC, BGA-357

compliant

3A991.A.2

8542.31.00.01

NXP

MPC859TZP100

Motorola Mobility LLC

Check for Price

Transferred

100 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

REQUIRES 3.3V I/O SUPPLY

YES

FIXED POINT

YES

1.9 V

1.7 V

S-PBGA-B357

Not Qualified

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

MOTOROLA INC

BGA,

unknown

3A991.A.2

8542.31.00.01

BGA

357

MPC859PZP133

Freescale Semiconductor

Check for Price

Obsolete

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

1.9 V

1.7 V

S-PBGA-B357

Not Qualified

220

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

FREESCALE SEMICONDUCTOR INC

BGA,

not_compliant

5A991

8542.31.00.01

BGA

357

MPC859DSLVR66A

NXP Semiconductors

Check for Price

Yes

Obsolete

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

1.9 V

1.7 V

OTHER

S-PBGA-B357

Not Qualified

95 °C

245

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

NXP SEMICONDUCTORS

LEAD FREE, PLASTIC, BGA-357

compliant

3A991.A.2

8542.31.00.01

MPC859PZP133

Motorola Mobility LLC

Check for Price

Transferred

133 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

1.9 V

1.7 V

S-PBGA-B357

Not Qualified

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

MOTOROLA INC

BGA,

unknown

8542.31.00.01

BGA

357

MPC859DSLZP66

Motorola Semiconductor Products

Check for Price

Transferred

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

REQUIRES 3.3V I/O SUPPLY

YES

FIXED POINT

YES

1.9 V

1.7 V

S-PBGA-B357

Not Qualified

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

MOTOROLA INC

BGA,

unknown

3A991.A.2

8542.31.00.01

MPC859DSLZP66

Motorola Mobility LLC

Check for Price

Transferred

66 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

REQUIRES 3.3V I/O SUPPLY

YES

FIXED POINT

YES

1.9 V

1.7 V

S-PBGA-B357

Not Qualified

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

MOTOROLA INC

BGA,

unknown

3A991.A.2

8542.31.00.01

BGA

357

MPC859DSLZP66A

NXP Semiconductors

Check for Price

Obsolete

66 MHz

66.67 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

1.9 V

1.7 V

S-PBGA-B357

357

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

NXP SEMICONDUCTORS

BGA-357

unknown

3A991.A.2

8542.31.00.01

MPC859DSLZP50A

NXP Semiconductors

Check for Price

Obsolete

50 MHz

YES

1.8 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

1.9 V

1.7 V

OTHER

S-PBGA-B357

Not Qualified

95 °C

220

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.52 mm

25 mm

NXP SEMICONDUCTORS

PLASTIC, BGA-357

unknown

3A991.A.2

8542.31.00.01

935321141557

NXP Semiconductors

Check for Price

Obsolete

MICROPROCESSOR, RISC

245

TIN SILVER COPPER

NXP SEMICONDUCTORS

unknown

8542.31.00.01

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