Filter Your Search
1 - 10 of 14 results
Select Parts | Part Number |
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MCIMX31LCVKN5DR2
NXP Semiconductors
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MCIMX31LCVMN4C
NXP Semiconductors
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MCIMX31LCJMN4D
NXP Semiconductors
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MCIMX31LCVKN5D
Freescale Semiconductor
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MCIMX31LCVKN5D
NXP Semiconductors
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MCIMX31LCVMN4CR2
Freescale Semiconductor
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MCIMX31LCJKN5D
Freescale Semiconductor
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MCIMX31LCVKN5C
Freescale Semiconductor
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MCIMX31LCJKN5D
NXP Semiconductors
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MCIMX31LCVMN4C
Freescale Semiconductor
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Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||
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Composite Price
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Pbfree Code
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Rohs Code
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Part Life Cycle Code
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Surface Mount
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Supply Voltage-Nom |
uPs/uCs/Peripheral ICs Type
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Technology |
Additional Feature
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Supply Voltage-Max
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Supply Voltage-Min
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Temperature Grade
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JESD-30 Code
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Qualification Status
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JESD-609 Code
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Moisture Sensitivity Level
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Operating Temperature-Max
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Operating Temperature-Min
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Peak Reflow Temperature (Cel)
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Time@Peak Reflow Temperature-Max (s)
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Number of Terminals
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Package Body Material
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Package Code
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Package Equivalence Code
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Package Shape
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Package Style
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Seated Height-Max
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Width
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Length
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Ihs Manufacturer
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Reach Compliance Code
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ECCN Code
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HTS Code
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Samacsys Manufacturer
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Part Package Code
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Package Description
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Pin Count
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Yes | Active | YES | MULTIFUNCTION PERIPHERAL | INDUSTRIAL | S-PBGA-B457 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 457 | PLASTIC/EPOXY | FBGA | BGA457,26X26,20 | SQUARE | GRID ARRAY, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | NXP SEMICONDUCTORS | compliant | 5A992.C | 8542.31.00.01 | NXP | |||||||||||||
Yes | Obsolete | NXP SEMICONDUCTORS | compliant | 5A992.C | 8542.31.00.01 | NXP | ||||||||||||||||||||||||||||||||||
Yes | Obsolete | NXP SEMICONDUCTORS | unknown | 8542.31.00.01 | ||||||||||||||||||||||||||||||||||||
Yes | Yes | Transferred | YES | SoC | CMOS | UNAVAILABLE FOR IMPORT OR SALE IN US | 1.65 V | 1.52 V | INDUSTRIAL | S-PBGA-B457 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 457 | PLASTIC/EPOXY | LFBGA | BGA457,26X26,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER OVER NICKEL | BALL | 500 µm | BOTTOM | 1.3 mm | 14 mm | 14 mm | FREESCALE SEMICONDUCTOR INC | compliant | 5A002.A | 8542.31.00.01 | BGA | 14 X 14 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-457 | 457 | ||||
Yes | Active | YES | SoC | CMOS | UNAVAILABLE FOR IMPORT OR SALE IN US | 1.65 V | 1.52 V | INDUSTRIAL | S-PBGA-B457 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 457 | PLASTIC/EPOXY | LFBGA | BGA457,26X26,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 1.3 mm | 14 mm | 14 mm | NXP SEMICONDUCTORS | compliant | 5A992.C | 8542.31.00.01 | NXP | 14 X 14 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-457 | |||||
Yes | Obsolete | YES | 1.4 V | SoC | CMOS | 1.47 V | 1.22 V | INDUSTRIAL | S-PBGA-B473 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 473 | PLASTIC/EPOXY | LFBGA | BGA473,23X23,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER OVER NICKEL | BALL | 800 µm | BOTTOM | 1.54 mm | 19 mm | 19 mm | FREESCALE SEMICONDUCTOR INC | compliant | 5A002.A | 8542.31.00.01 | BGA | MAPBGA-473 | 473 | |||||
Yes | Transferred | YES | SoC | CMOS | 1.65 V | 1.52 V | INDUSTRIAL | S-PBGA-B457 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 457 | PLASTIC/EPOXY | LFBGA | BGA457,26X26,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 500 µm | BOTTOM | 1.3 mm | 14 mm | 14 mm | FREESCALE SEMICONDUCTOR INC | compliant | 8542.31.00.01 | BGA | LFBGA, BGA457,26X26,20 | 457 | |||||||||
Yes | Obsolete | YES | 1.6 V | SoC | CMOS | 1.65 V | 1.55 V | INDUSTRIAL | S-PBGA-B457 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 457 | PLASTIC/EPOXY | LFBGA | BGA457,26X26,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER OVER NICKEL | BALL | 500 µm | BOTTOM | 1.3 mm | 14 mm | 14 mm | FREESCALE SEMICONDUCTOR INC | compliant | 5A002 | 8542.31.00.01 | BGA | 14 X 14 MM, 0.50 MM PITCH, ROHS COMPLIANT, MAPBGA-457 | 457 | |||||
Yes | Active | YES | SoC | CMOS | 1.65 V | 1.52 V | INDUSTRIAL | S-PBGA-B457 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 457 | PLASTIC/EPOXY | LFBGA | BGA457,26X26,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 500 µm | BOTTOM | 1.3 mm | 14 mm | 14 mm | NXP SEMICONDUCTORS | compliant | 8542.31.00.01 | LFBGA, BGA457,26X26,20 | |||||||||||
Yes | Yes | Transferred | YES | 1.4 V | SoC | CMOS | 1.47 V | 1.22 V | INDUSTRIAL | S-PBGA-B473 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 473 | PLASTIC/EPOXY | LFBGA | BGA473,23X23,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER OVER NICKEL | BALL | 800 µm | BOTTOM | 1.54 mm | 19 mm | 19 mm | FREESCALE SEMICONDUCTOR INC | compliant | 5A002.A | 8542.31.00.01 | BGA | MAPBGA-473 | 473 |
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MCIMX31LCVKN5DR2
NXP Semiconductors
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$32.6150 Buy | Yes | Active | YES | MULTIFUNCTION PERIPHERAL | INDUSTRIAL | S-PBGA-B457 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 457 | PLASTIC/EPOXY | FBGA | BGA457,26X26,20 | SQUARE | GRID ARRAY, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | NXP SEMICONDUCTORS | compliant | 5A992.C | 8542.31.00.01 | NXP | ||||||||||||||
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MCIMX31LCVMN4C
NXP Semiconductors
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$39.8450 Buy | Yes | Obsolete | NXP SEMICONDUCTORS | compliant | 5A992.C | 8542.31.00.01 | NXP | |||||||||||||||||||||||||||||||||||
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MCIMX31LCJMN4D
NXP Semiconductors
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Check for Price Buy | Yes | Obsolete | NXP SEMICONDUCTORS | unknown | 8542.31.00.01 | |||||||||||||||||||||||||||||||||||||
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MCIMX31LCVKN5D
Freescale Semiconductor
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Check for Price Buy | Yes | Yes | Transferred | YES | SoC | CMOS | UNAVAILABLE FOR IMPORT OR SALE IN US | 1.65 V | 1.52 V | INDUSTRIAL | S-PBGA-B457 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 457 | PLASTIC/EPOXY | LFBGA | BGA457,26X26,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER OVER NICKEL | BALL | 500 µm | BOTTOM | 1.3 mm | 14 mm | 14 mm | FREESCALE SEMICONDUCTOR INC | compliant | 5A002.A | 8542.31.00.01 | BGA | 14 X 14 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-457 | 457 | |||||
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MCIMX31LCVKN5D
NXP Semiconductors
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Check for Price Buy | Yes | Active | YES | SoC | CMOS | UNAVAILABLE FOR IMPORT OR SALE IN US | 1.65 V | 1.52 V | INDUSTRIAL | S-PBGA-B457 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 457 | PLASTIC/EPOXY | LFBGA | BGA457,26X26,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 1.3 mm | 14 mm | 14 mm | NXP SEMICONDUCTORS | compliant | 5A992.C | 8542.31.00.01 | NXP | 14 X 14 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-457 | ||||||
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MCIMX31LCVMN4CR2
Freescale Semiconductor
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Check for Price Buy | Yes | Obsolete | YES | 1.4 V | SoC | CMOS | 1.47 V | 1.22 V | INDUSTRIAL | S-PBGA-B473 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 473 | PLASTIC/EPOXY | LFBGA | BGA473,23X23,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER OVER NICKEL | BALL | 800 µm | BOTTOM | 1.54 mm | 19 mm | 19 mm | FREESCALE SEMICONDUCTOR INC | compliant | 5A002.A | 8542.31.00.01 | BGA | MAPBGA-473 | 473 | ||||||
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MCIMX31LCJKN5D
Freescale Semiconductor
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Check for Price Buy | Yes | Transferred | YES | SoC | CMOS | 1.65 V | 1.52 V | INDUSTRIAL | S-PBGA-B457 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 457 | PLASTIC/EPOXY | LFBGA | BGA457,26X26,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 500 µm | BOTTOM | 1.3 mm | 14 mm | 14 mm | FREESCALE SEMICONDUCTOR INC | compliant | 8542.31.00.01 | BGA | LFBGA, BGA457,26X26,20 | 457 | ||||||||||
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MCIMX31LCVKN5C
Freescale Semiconductor
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Check for Price Buy | Yes | Obsolete | YES | 1.6 V | SoC | CMOS | 1.65 V | 1.55 V | INDUSTRIAL | S-PBGA-B457 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 457 | PLASTIC/EPOXY | LFBGA | BGA457,26X26,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER OVER NICKEL | BALL | 500 µm | BOTTOM | 1.3 mm | 14 mm | 14 mm | FREESCALE SEMICONDUCTOR INC | compliant | 5A002 | 8542.31.00.01 | BGA | 14 X 14 MM, 0.50 MM PITCH, ROHS COMPLIANT, MAPBGA-457 | 457 | ||||||
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MCIMX31LCJKN5D
NXP Semiconductors
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Check for Price Buy | Yes | Active | YES | SoC | CMOS | 1.65 V | 1.52 V | INDUSTRIAL | S-PBGA-B457 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 457 | PLASTIC/EPOXY | LFBGA | BGA457,26X26,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 500 µm | BOTTOM | 1.3 mm | 14 mm | 14 mm | NXP SEMICONDUCTORS | compliant | 8542.31.00.01 | LFBGA, BGA457,26X26,20 | ||||||||||||
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MCIMX31LCVMN4C
Freescale Semiconductor
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Check for Price Buy | Yes | Yes | Transferred | YES | 1.4 V | SoC | CMOS | 1.47 V | 1.22 V | INDUSTRIAL | S-PBGA-B473 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 473 | PLASTIC/EPOXY | LFBGA | BGA473,23X23,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER OVER NICKEL | BALL | 800 µm | BOTTOM | 1.54 mm | 19 mm | 19 mm | FREESCALE SEMICONDUCTOR INC | compliant | 5A002.A | 8542.31.00.01 | BGA | MAPBGA-473 | 473 |