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MB84VD22280FA-70PBS
Spansion
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Check for Price | No | Obsolete | 33.5544 Mbit | 16 | 2MX16 | 3 V | 70 ns | MEMORY CIRCUIT | SRAM IS ORGANIZED AS 512K X 16 | FLASH+SRAM | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 5 µA | 50 µA | 3.1 V | 2.7 V | CMOS | OTHER | R-PBGA-B59 | Not Qualified | e0 | 85 °C | -30 °C | 59 | PLASTIC/EPOXY | TFBGA | BGA59,8X10,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.2 mm | 9 mm | 7 mm | SPANSION INC | BGA | TFBGA, BGA59,8X10,32 | 59 | compliant | EAR99 | 8542.32.00.71 | |||
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MB84VD22280FA-70PBS
Cypress Semiconductor
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Check for Price | Active | 3 V | 3 V | 70 ns | MEMORY CIRCUIT | FLASH+SRAM | 5 µA | 50 µA | CMOS | OTHER | R-PBGA-B59 | Not Qualified | 85 °C | -30 °C | 59 | PLASTIC/EPOXY | FBGA | BGA59,8X10,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | CYPRESS SEMICONDUCTOR CORP | compliant | |||||||||||||||||||||||
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MB84VD22280FA-70PBS
FUJITSU Semiconductor Limited
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Check for Price | Active | 3 V | 70 ns | MEMORY CIRCUIT | FLASH+SRAM | 5 µA | 50 µA | HYBRID | OTHER | R-PBGA-B59 | Not Qualified | 85 °C | -30 °C | 59 | PLASTIC/EPOXY | FBGA | BGA59,8X10,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | FUJITSU LTD | FBGA, BGA59,8X10,32 | compliant | EAR99 | 8542.32.00.71 | |||||||||||||||||||||
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MB84VD22280FA-70PBS
FUJITSU Limited
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Check for Price | Active | 3 V | 70 ns | MEMORY CIRCUIT | FLASH+SRAM | 5 µA | 50 µA | HYBRID | OTHER | R-PBGA-B59 | Not Qualified | 85 °C | -30 °C | 59 | PLASTIC/EPOXY | FBGA | BGA59,8X10,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | FUJITSU LTD | FBGA, BGA59,8X10,32 | compliant | EAR99 | 8542.32.00.71 | |||||||||||||||||||||
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MB84VD22280FA-70PBS-E1
Spansion
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 16 | 2MX16 | 3 V | MEMORY CIRCUIT | SRAM IS ORGANIZED AS 512K X 16 | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 3.1 V | 2.7 V | CMOS | OTHER | R-PBGA-B59 | Not Qualified | e1 | 85 °C | -30 °C | 59 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 9 mm | 7 mm | SPANSION INC | BGA | TFBGA, | 59 | compliant | EAR99 | 8542.32.00.71 |