Parametric results for: max7359. under Other uPs/uCs/Peripheral ICs
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MAX7359ETG+
Maxim Integrated Products
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$6.6614 | Yes | Yes | Transferred | YES | 2.5 V | MICROPROCESSOR CIRCUIT | BICMOS | 60 µA | 3.6 V | 1.62 V | INDUSTRIAL | S-XQCC-N24 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 24 | UNSPECIFIED | HVQCCN | LCC24,.13SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 400 µm | QUAD | 850 µm | 3.5 mm | 3.5 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 3.50 X 3.50 MM, ROHS COMPLIANT, TQFN-24 | 24 | compliant | EAR99 | 8542.31.00.01 | |||||
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MAX7359EWA+
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | YES | 2.5 V | MICROPROCESSOR CIRCUIT | BICMOS | 60 µA | 3.6 V | 1.62 V | INDUSTRIAL | S-PBGA-B25 | Not Qualified | e2 | 1 | 85 °C | -40 °C | 260 | 30 | 25 | PLASTIC/EPOXY | VFBGA | BGA25,5X5,16 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TIN SILVER COPPER NICKEL | BALL | 400 µm | BOTTOM | 690 µm | 2.09 mm | 2.09 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | VFBGA, BGA25,5X5,16 | 25 | compliant | EAR99 | 8542.31.00.01 | |||||
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MAX7359ETG+G47
Maxim Integrated Products
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Check for Price | Yes | Obsolete | YES | 2.5 V | MICROPROCESSOR CIRCUIT | BICMOS | 3.6 V | 1.62 V | INDUSTRIAL | S-XQCC-N24 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 24 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 400 µm | QUAD | 800 µm | 3.5 mm | 3.5 mm | MAXIM INTEGRATED PRODUCTS INC | TQFN-24 | compliant | 8542.31.00.01 | |||||||||||||||
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MAX7359BETG+T
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | YES | 2.5 V | MICROPROCESSOR CIRCUIT | BICMOS | 3.6 V | 1.62 V | INDUSTRIAL | S-XQCC-N24 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 24 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 400 µm | QUAD | 800 µm | 3.5 mm | 3.5 mm | MAXIM INTEGRATED PRODUCTS INC | TQFN-24 | compliant | 8542.31.00.01 | |||||||||||
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MAX7359EWA+T
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | YES | 2.5 V | MICROPROCESSOR CIRCUIT | BICMOS | 3.6 V | 1.62 V | INDUSTRIAL | S-XBGA-B25 | e2 | 1 | 85 °C | -40 °C | 260 | 30 | 25 | UNSPECIFIED | VFBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TIN SILVER COPPER NICKEL | BALL | 400 µm | BOTTOM | 690 µm | 2.09 mm | 2.09 mm | MAXIM INTEGRATED PRODUCTS INC | VFBGA, | compliant | 8542.31.00.01 | |||||||||||
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MAX7359BETG+
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | YES | 2.5 V | MICROPROCESSOR CIRCUIT | BICMOS | 3.6 V | 1.62 V | INDUSTRIAL | S-XQCC-N24 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 24 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 400 µm | QUAD | 800 µm | 3.5 mm | 3.5 mm | MAXIM INTEGRATED PRODUCTS INC | TQFN-24 | compliant | 8542.31.00.01 | |||||||||||
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MAX7359ETG+
Analog Devices Inc
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Check for Price | Yes | Active | YES | 2.5 V | MICROPROCESSOR CIRCUIT | BICMOS | 60 µA | 3.6 V | 1.62 V | INDUSTRIAL | S-XQCC-N24 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 24 | UNSPECIFIED | HVQCCN | LCC24,.13SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 400 µm | QUAD | 850 µm | 3.5 mm | 3.5 mm | ANALOG DEVICES INC | 24-LFCSP-3.5X3.5X0.75 | 3.50 X 3.50 MM, ROHS COMPLIANT, TQFN-24 | 24 | compliant | 24-LFCSP-3.5X3.5X0.75 | 2007-08-16 | Analog Devices | |||||
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MAX7359ETG+T
Analog Devices Inc
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Check for Price | Yes | Active | YES | 2.5 V | MICROPROCESSOR CIRCUIT | BICMOS | 3.6 V | 1.62 V | INDUSTRIAL | S-XQCC-N24 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 24 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 400 µm | QUAD | 800 µm | 3.5 mm | 3.5 mm | ANALOG DEVICES INC | 24-LFCSP-3.5X3.5X0.75 | TQFN-24 | 24 | compliant | 24-LFCSP-3.5X3.5X0.75 | 2007-08-16 | Analog Devices | ||||||||
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MAX7359ETG+TG47
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | YES | 2.5 V | MICROPROCESSOR CIRCUIT | BICMOS | 3.6 V | 1.62 V | INDUSTRIAL | S-XQCC-N24 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 24 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 400 µm | QUAD | 800 µm | 3.5 mm | 3.5 mm | MAXIM INTEGRATED PRODUCTS INC | HVQCCN, | compliant | 8542.31.00.01 | |||||||||||
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MAX7359ETG+T
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | YES | 2.5 V | MICROPROCESSOR CIRCUIT | BICMOS | 3.6 V | 1.62 V | INDUSTRIAL | S-XQCC-N24 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 24 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 400 µm | QUAD | 800 µm | 3.5 mm | 3.5 mm | MAXIM INTEGRATED PRODUCTS INC | TQFN-24 | compliant | EAR99 | 8542.31.00.01 |