Parametric results for: k8d6316utmdc07 under Flash Memories

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Manufacturer Part Number: k8d6316utmdc07
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K8D6316UTM-DC07
Samsung Semiconductor
Check for Price Yes Active 67.1089 Mbit 16 8K,64K 4MX16 70 ns FLASH 8 TOP YES YES YES 8,127 4000000 4.1943 M PARALLEL YES 30 µA 50 µA CMOS COMMERCIAL YES NOR TYPE R-PBGA-B48 Not Qualified 70 °C 48 PLASTIC/EPOXY FBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM SAMSUNG SEMICONDUCTOR INC FBGA, BGA48,6X8,32 compliant EAR99 8542.32.00.51
K8D6316UTMDC0700
Samsung Semiconductor
Check for Price Yes Obsolete 67.1089 Mbit 16 4MX16 3 V 70 ns FLASH 8 TOP 1 4000000 4.1943 M ASYNCHRONOUS PARALLEL 2.7 V 3.6 V 2.7 V CMOS COMMERCIAL NOR TYPE R-PBGA-B48 Not Qualified e1 2 70 °C 48 PLASTIC/EPOXY VFBGA RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1 mm 9 mm 6 mm SAMSUNG SEMICONDUCTOR INC 6 X 9 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48 compliant EAR99 8542.32.00.51 BGA 48
K8D6316UTM-DC070
Samsung Semiconductor
Check for Price Yes Obsolete 67.1089 Mbit 16 8K,64K 4MX16 3 V 70 ns FLASH 8 TOP YES YES YES 1 8,127 4000000 4.1943 M ASYNCHRONOUS PARALLEL 2.7 V YES 30 µA 50 µA 3.6 V 2.7 V CMOS COMMERCIAL YES NOR TYPE R-PBGA-B48 Not Qualified e1 2 70 °C 48 PLASTIC/EPOXY VFBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1 mm 9 mm 6 mm SAMSUNG SEMICONDUCTOR INC 6 X 9 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48 compliant EAR99 8542.32.00.51 BGA 48
K8D6316UTM-DC07T
Samsung Semiconductor
Check for Price Yes Active 67.1089 Mbit 16 8K,64K 4MX16 70 ns FLASH 8 TOP YES YES YES 8,127 4000000 4.1943 M PARALLEL YES 30 µA 50 µA CMOS COMMERCIAL YES NOR TYPE R-PBGA-B48 Not Qualified 70 °C 48 PLASTIC/EPOXY FBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM SAMSUNG SEMICONDUCTOR INC FBGA, BGA48,6X8,32 compliant EAR99 8542.32.00.51