Findchips: Parametric Search Results for idt71v65603

Parametric results for: idt71v65603 under SRAMs

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		IDT71V65603ZS100BGGI Integrated Device Technology Inc
		IDT71V65603S100BGG Integrated Device Technology Inc
		71V65603ZS133BGG Integrated Device Technology Inc
		IDT71V65603S100PFGI8 Integrated Device Technology Inc
		71V65603ZS100BQG Integrated Device Technology Inc
		IDT71V65603ZS100BQG Integrated Device Technology Inc
		IDT71V65603Z133BQG Integrated Device Technology Inc
		IDT71V65603S150BQGI Integrated Device Technology Inc
		IDT71V65603S100BQGI Integrated Device Technology Inc
		71V65603ZS100BGG Integrated Device Technology Inc

				Most Relevant					Technical																Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

5 ns

ZBT SRAM

BURST COUNTER

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B119

Not Qualified

85 °C

-40 °C

119

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.36 mm

22 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

BGA,

119

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

5 ns

ZBT SRAM

BURST COUNTER

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

250 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B119

Not Qualified

70 °C

260

119

PLASTIC/EPOXY

BGA

BGA119,7X17,50

RECTANGULAR

GRID ARRAY

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.36 mm

22 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

BGA, BGA119,7X17,50

119

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

4.2 ns

ZBT SRAM

BURST COUNTER

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B119

Not Qualified

70 °C

119

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.36 mm

22 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA,

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

5 ns

ZBT SRAM

PIPELINED ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP,

100

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

5 ns

ZBT SRAM

BURST COUNTER

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

TBGA,

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

5 ns

ZBT SRAM

BURST COUNTER

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA,

165

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

3.8 ns

ZBT SRAM

PIPELINED ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA,

165

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

3.8 ns

ZBT SRAM

PIPELINED ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

60 mA

3.14 V

345 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

260

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA, BGA165,11X15,40

165

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

5 ns

ZBT SRAM

BURST COUNTER

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

60 mA

3.14 V

270 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

260

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA, BGA165,11X15,40

165

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

5 ns

ZBT SRAM

BURST COUNTER

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B119

Not Qualified

70 °C

119

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.36 mm

22 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA,

compliant

3A991.B.2.A

8542.32.00.41

1 2 3 4 5 Next

Compare

IDT71V65603ZS100BGGI

Integrated Device Technology Inc

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

5 ns

ZBT SRAM

BURST COUNTER

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B119

Not Qualified

85 °C

-40 °C

119

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.36 mm

22 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

BGA,

119

compliant

3A991.B.2.A

8542.32.00.41

IDT71V65603S100BGG

Integrated Device Technology Inc

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

5 ns

ZBT SRAM

BURST COUNTER

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

250 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B119

Not Qualified

70 °C

260

119

PLASTIC/EPOXY

BGA

BGA119,7X17,50

RECTANGULAR

GRID ARRAY

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.36 mm

22 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

BGA, BGA119,7X17,50

119

compliant

3A991.B.2.A

8542.32.00.41

71V65603ZS133BGG

Integrated Device Technology Inc

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

4.2 ns

ZBT SRAM

BURST COUNTER

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B119

Not Qualified

70 °C

119

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.36 mm

22 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA,

compliant

3A991.B.2.A

8542.32.00.41

IDT71V65603S100PFGI8

Integrated Device Technology Inc

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

5 ns

ZBT SRAM

PIPELINED ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP,

100

compliant

3A991.B.2.A

8542.32.00.41

71V65603ZS100BQG

Integrated Device Technology Inc

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

5 ns

ZBT SRAM

BURST COUNTER

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

TBGA,

compliant

3A991.B.2.A

8542.32.00.41

IDT71V65603ZS100BQG

Integrated Device Technology Inc

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

5 ns

ZBT SRAM

BURST COUNTER

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA,

165

compliant

3A991.B.2.A

8542.32.00.41

IDT71V65603Z133BQG

Integrated Device Technology Inc

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

3.8 ns

ZBT SRAM

PIPELINED ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA,

165

compliant

3A991.B.2.A

8542.32.00.41

IDT71V65603S150BQGI

Integrated Device Technology Inc

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

3.8 ns

ZBT SRAM

PIPELINED ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

60 mA

3.14 V

345 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

260

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA, BGA165,11X15,40

165

compliant

3A991.B.2.A

8542.32.00.41

IDT71V65603S100BQGI

Integrated Device Technology Inc

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

5 ns

ZBT SRAM

BURST COUNTER

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

60 mA

3.14 V

270 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

260

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA, BGA165,11X15,40

165

compliant

3A991.B.2.A

8542.32.00.41

71V65603ZS100BGG

Integrated Device Technology Inc

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

5 ns

ZBT SRAM

BURST COUNTER

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B119

Not Qualified

70 °C

119

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.36 mm

22 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA,

compliant

3A991.B.2.A

8542.32.00.41

1 2 3 4 5 Next