Parametric results for: ic 8mbit flash 1mx8 512kx... under Flash Memories

All Filters Access Time-Max Additional Feature Alternate Memory Width Boot Block Clock Frequency-Max (fCLK) Command User Interface Common Flash Interface Data Polling Data Retention Time-Min Endurance JESD-30 Code JESD-609 Code Length Manufacturer Memory Density Memory IC Type Memory Width Mixed Memory Type Moisture Sensitivity Level Number of Functions Number of Ports Number of Sectors/Size Number of Terminals Number of Words Number of Words Code Operating Mode Operating Temperature-Max Operating Temperature-Min Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style Page Size Parallel/Serial Power Supplies Sector Size Supply Voltage-Nom (Vsup) Access Time-Max (27)

10 ns 1 11 ns 152 15 ns 8 19 ns 7 20 ns 30 30 ns 34 45 ns 258 50 ns 12 55 ns 1,136 60 ns 248 65 ns 8 70 ns 3,665 76 ns 2 80 ns 1,356 85 ns 164 90 ns 3,600 95 ns 22 100 ns 2,125 110 ns 68 120 ns 3,836 135 ns 1 150 ns 1,587 170 ns 170 200 ns 520 220 ns 14 250 ns 113 300 ns 4

Min (ns) - Max (ns)

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10000 PROGRAM/ERASE CYCLES; CONFG AS 512K X 16; BOTTOM BOOT BLOCK 56 10000 PROGRAM/ERASE CYCLES; CONFG AS 512K X 16; TOP BOOT BLOCK 56 10000 PROGRAM/ERASE CYCLES; USER CONFG AS 512K X 16; BOTTOM BOOT BLOCK 48 10000 PROGRAM/ERASE CYCLES; USER CONFG AS 512K X 16; TOP BOOT BLOCK 48 100000 PROGRAM/ERASE CYCLES; CONFG AS 512K X 16; BOTTOM BOOT BLOCK 56 100000 PROGRAM/ERASE CYCLES; CONFG AS 512K X 16; TOP BOOT BLOCK 56 100000 PROGRAM/ERASE CYCLES; SECTOR ERASE 36 100000 PROGRAM/ERASE CYCLES; USER CONFG AS 512K X 16; BOTTOM BOOT BLOCK 48 100000 PROGRAM/ERASE CYCLES; USER CONFG AS 512K X 16; TOP BOOT BLOCK 48 100K ERASE/WRITE CYCLES 60 100K WRITE/ERASE CYCLES MIN 120 10K ERASE CYCLE 80 20 YEAR DATA RETENTION 108 20 YEARS DATA RETENTION; BOTTOM BOOT BLOCK 216 20 YEARS DATA RETENTION; TOP BOOT BLOCK 216 ALSO CONFIGURABLE AS 1M X 8 64 AUTOMATIC WRITE 107 AUTOMATIC WRITE; DEEP POWER-DOWN 74 BOTTOM BOOT BLOCK 2,416 BOTTOM BOOT SECTOR 88 CAN ALSO BE CONFIGURED AS 512K X 16 108 CAN BE OPERATED FROM 3 TO 3.6 VOLTS REGULATED; TOP BOOT BLOCK 60 CONFG AS 512K X 16; BOTTOM BOOT BLOCK 309 CONFG AS 512K X 16; TOP BOOT BLOCK 309 CONFG AS 512K X 16; USER SELECTABLE 5V VCC; BOTTOM BOOT BLOCK 72 CONFG AS 512K X 16; USER SELECTABLE 5V VCC; TOP BOOT BLOCK 72 CONFIGURABLE AS 256K X 32 OR 128K X 64 42 CONFIGURABLE AS 512K X 16 607 CONFIGURABLE AS 512K X 16; 100000 PROGRAM/ERASE CYCLES 48 EMBEDDED ALGORITHMS; 20 YEAR DATA RETENTION 64 HARDWARE DATA PROTECTION 55 HARDWARE DATA PROTECTION; 10000 WRITE CYCLES 60 HARDWARE DATA PROTECTION; BYTE PROGRAMMABLE 42 HARDWARE DATA PROTECTION; BYTE PROGRAMMABLE; BOTTOM BOOT BLOCK 36 LG-MAX 64 MINIMUM 1,000,000 PROGRAM/ERASE CYCLES PER SECTOR; 20-YEAR DATA RETENTION 122 MINIMUM 100000 PROGRAM/ERASE CYCLES 93 MINIMUM 1000000 PROGRAM/ERASE CYCLES 91 MINIMUM 1000K PROGRAM/ERASE CYCLE ;20 YEAR DATA RETENTION 44 MINIMUM 1000K PROGRAM/ERASE CYCLES; CAN ALSO BE CONFIGURED AS 512K X 16 64 MINIMUM 1000K WRITE CYCLE; 20 YEAR DATA RETENTION 60 MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA RETENTION 64 MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA RETENTION; CAN ALSO BE CONFIGURABLE AS 512K X 16 108 SELECTABLE 3V OR 5V VPP 132 TOP BOOT BLOCK 2,421 TOP BOOT SECTOR 84 USER CONFG AS 512K X 16; BOTTOM BOOT BLOCK 60 USER CONFG AS 512K X 16; TOP BOOT BLOCK 60 USER CONFIGURABLE AS 512K X 16 120 USER CONFIGURABLE AS 512K X 16; HARDWARE DATA PROTECTION 48

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1 66 2 9 4 11 8 11,065 16 75

Min - Max

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BOTTOM 7,529 BOTTOM/TOP 104 TOP 7,389

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Clock Frequency-Max (fCLK) (21)

8 MHz 1 10 MHz 4 16 MHz 1 20 MHz 8 25 MHz 66 30 MHz 8 33 MHz 101 40 MHz 51 50 MHz 229 66 MHz 54 70 MHz 13 75 MHz 394 76 MHz 12 80 MHz 76 85 MHz 12 86 MHz 20 100 MHz 92 104 MHz 304 108 MHz 31 120 MHz 39 133 MHz 177

Min (MHz) - Max (MHz)

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NO 16 YES 9,869

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NO 57 YES 2,028

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NO 1,816 YES 8,495

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10 55 20 2,344 100 127

Min - Max

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1000.0 Write/Erase Cycles 6 2000.0 Write/Erase Cycles 28 10000.0 Write/Erase Cycles 527 100000.0 Write/Erase Cycles 4,030 1000000.0 Write/Erase Cycles 2,105 1.0E8 Write/Erase Cycles 8

Min (Write/EraseCycles) - Max (Write/EraseCycles)

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R-CDMA-T40 12 R-CPGA-P50 28 R-CQCC-J48 28 R-CQCC-N40 16 R-CQCC-N48 68 R-CQFP-G48 28 R-CQIP-T48 28 R-PBGA-B24 11 R-PBGA-B42 38 R-PBGA-B45 60 R-PBGA-B46 145 R-PBGA-B48 3,141 R-PBGA-B52 24 R-PBGA-B56 10 R-PBGA-B64 21 R-PBGA-B8 22 R-PDIP-T42 10 R-PDIP-T8 108 R-PDSO-C48 26 R-PDSO-G16 54 R-PDSO-G32 46 R-PDSO-G40 3,312 R-PDSO-G44 4,024 R-PDSO-G48 5,893 R-PDSO-G56 127 R-PDSO-G8 766 R-PDSO-N46 36 R-PDSO-N8 423 R-PQCC-J32 76 R-PSMA-N64 10 R-XDSO-N8 91 R-XPGA-P50 124 R-XQCC-J48 16 R-XQCC-N48 16 R-XQFP-G48 90 R-XQIP-T48 56 R-XQMA-J48 40 R-XUUC-N43 10 R-XUUC-N44 500 R-XUUC-N51 32 R-XXMA-X68 72 S-CQFP-F116 51 S-CQMA-F116 42 S-PBGA-B42 16 S-PBGA-B48 152 S-PDSO-G8 177 S-XPGA-P66 34 X-XUUC-N 13 X-XUUC-N44 249 X-XXMA-X68 221

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e0 7,428 e1 880 e2 1 e3 2,086 e3/e4 52 e3/e6 195 e4 137 e6 103

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3 mm 80 4 mm 47 4.26 mm 16 4.85 mm 33 4.9 mm 311 4.925 mm 63 5.23 mm 15 5.27 mm 15 5.275 mm 44 5.28 mm 119 5.283 mm 27 5.29 mm 47 5.3 mm 66 5.62 mm 12 6 mm 464 6.05 mm 64 6.39 mm 132 6.8 mm 24 7 mm 121 7.06 mm 32 7.91 mm 27 8 mm 764 8.15 mm 440 9 mm 900 9.1 mm 16 9.14 mm 18 9.27 mm 20 9.271 mm 16 10 mm 20 10.3 mm 32 11.25 mm 54 12 mm 42 12.4 mm 39 13 mm 30 13.97 mm 66 14 mm 39 17 mm 24 18.4 mm 7,763 19.05 mm 16 21.844 mm 20 22.098 mm 68 22.352 mm 54 23.7 mm 71 25.146 mm 85 27.94 mm 16 28.195 mm 190 28.2 mm 2,894 28.45 mm 83 28.5 mm 254 39.6 mm 30

Min (mm) - Max (mm)

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Manufacturer (66)

Adesto Technologies Corporation 38 Alliance Memory Inc 8 Alliance Semiconductor Corporation 208 AMD 2,222 AMI Semiconductor 1 AMIC Technology 339 APTA Group Inc 7 Atmel Corporation 540 B&B Electronics Manufacturing Company 335 Chengdu Sino Microelectronics Technology Co Ltd 60 Chingis Technology Corporation 10 Cypress Semiconductor 683 Dialog Semiconductor GmbH 71 Electronic Designs Inc 78 Elite Semiconductor Memory Technology Inc 186 ELM Technology Corp 12 ELMOS SEMICONDUCTOR AG 14 Elpaq 6 Eon Silicon Solution Inc 240 Epson Electronics America Inc 12 Excel (Suzhou) Semiconductor Co Ltd 268 Force Technologies Ltd 26 Freescale Semiconductor 31 FUJITSU Limited 351 FUJITSU Semiconductor Limited 239 GigaDevice Semiconductor (Beijing) Inc 40 Hitachi Ltd 26 Infineon Technologies AG 37 Integrated Silicon Solution Inc 237 Intel Corporation 290 Macronix International Co Ltd 748 Microchip Technology Inc 163 Micron Technology Inc 1,132 Microsemi Corporation 61 Mitsubishi Electric 143 Mosaic Semiconductor Inc 7 Motorola Mobility LLC 105 Motorola Semiconductor Products 105 NEC Electronics Group 36 Nexflash Technologies Inc 6 Numonyx Memory Solutions 1,645 OKI Electric Industry Co Ltd 3 onsemi 18 Renesas Electronics Corporation 139 Rochester Electronics LLC 73 Samsung Semiconductor 54 SANYO Electric Co Ltd 8 SANYO Semiconductor Co Ltd 6 Seiko Epson Corporation 14 Sharp Corp 281 Siemens 1 Silicon Storage Technology 165 SK Hynix Inc 221 SMART Modular Technology Inc 14 Spansion 3,751 STMicroelectronics 2,011 TE Connectivity 10 TE's AMP 10 Texas Instruments 2,642 Toshiba America Electronic Components 21 Twilight Technology Inc 259 White Electronic Designs Corp 108 White Microelectronics 36 White Technology Inc 2 Winbond Electronics Corp 238 XTX Technology (Shenzhen) Limited 9

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Memory Density (3)

8.3886 Mbit 20,597 8.7818 Mbit 2 16.7772 Mbit 261

Min (bit) - Max (bit)

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FLASH 19,974 FLASH CARD 331 FLASH MODULE 555

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Memory Width (2)

8 8,813 16 11,804

Min - Max

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EEPROM+FLASH 16 FLASH+SRAM 1

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1 319 2 36 2A 16 3 2,997 NOT SPECIFIED 10

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1.0 18,320 2.0 14

Min - Max

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1 91

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1,1 122 1,2,1 156 1,2,1,15 6,664 1,2,1,3,2 58 1,2,1,7 622 1,6,15 34 15,1,2,1 2 16 866 2,4,2,14 527 2,4,2,30 2 256 184 3,1 64 4 3 48,13 36 64 2 8 58 8,15 458 8,2,14 32 8,31 15 8K 35

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11 2 116 93 16 55 24 13 28 4 32 122 34 2 35 4 36 3 38 2 40 3,363 42 69 43 10 44 4,773 45 60 46 189 47 8 48 9,588 50 172 51 32 52 24 53 8 56 137 60 4 63 3 64 38 66 46 68 316 72 1 8 1,608 80 11 9 1

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524.288 k 11,780 1.0486 M 9,079

Min (words) - Max (words)

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512000.0 12,047 1000000.0 8,813

Min - Max

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ASYNCHRONOUS 16,435 SYNCHRONOUS 1,712

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55.0 °C 74 60.0 °C 69 70.0 °C 6,992 80.0 °C 2 85.0 °C 9,823 90.0 °C 8 105.0 °C 204 125.0 °C 3,464 145.0 °C 11

Min (°C) - Max (°C)

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-55.0 °C 1,577 -45.0 °C 8 -40.0 °C 11,202 -30.0 °C 2 -25.0 °C 184 -20.0 °C 634 0.0 °C 7,041

Min (°C) - Max (°C)

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Organization (2)

1MX8 8,813 512KX16 12,047

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3-STATE 3,125 OPEN-DRAIN 5

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CERAMIC 218 CERAMIC, METAL-SEALED COFIRED 393 PLASTIC/EPOXY 18,810 UNSPECIFIED 1,354

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APGA 68 AQCCJ 68 AQCCN 68 AQFP 68 AQIP 68 BGA 277 CSP 2 DFP 6 DIE 833 DIP 140 FBGA 619 HSON 1 HVQCCN 2 HVSON 407 LBGA 38 LFBGA 223 LSOP 2 PGA 123 QCCJ 92 QCCN 32 QFF 45 QFP 50 QIP 16 SIMM 18 SMA 1 SON 77 SOP 5,300 SSOP 95 TBGA 33 TFBGA 1,832 TSOC 6 TSOP 240 TSOP1 4,512 TSOP1-R 1,226 TSOP2 45 TSOP2-R 30 TSSOP 2,881 VBGA 24 VFBGA 620 VFLGA 6 VSOC 20 VSON 74 VSOP 80 WDIP 2

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BGA24,4X6,40 23 BGA42,6X7,40 36 BGA44,8X6,25 18 BGA45,6X8,30 48 BGA45,9X11,16/8 16 BGA46,6X8,30 68 BGA48,6X11,20 82 BGA48,6X8,20 52 BGA48,6X8,30 85 BGA48,6X8,32 1,854 BGA56,10X6,30 6 BGA64,8X8,40 28 BGA8,2X4,20 6 CARD68 25 DIE OR CHIP 34 DIP40,.6 14 DIP42,.6 6 DIP50,1.2 6 DIP8,.3 87 GWDIP50,1.5 6 LCC48,.5X.87 56 LDCC32,.5X.6 47 LDCC48,.51X.88 56 LGA48,6X11,20 26 LGA52(UNSPEC) 8 PGA50,5X10 124 PGA66,11X11 39 QFL116,1.56SQ 15 QFP48,.7X1.1,50 90 QUAD48,.9X.5,50 56 SOLCC8,.12,20 46 SOLCC8,.12,32 7 SOLCC8,.25 284 SOP16,.4 27 SOP44,.63 2,107 SOP56,.6,32 44 SOP8,.25 311 SOP8,.3 351 SSIM64 10 SSIM80 8 SSOP56,.64,32 32 TSOP40(UNSPEC) 38 TSOP8,.25 32 TSSOC48,.4,16 20 TSSOP32,.56,20 38 TSSOP40,.56,20 9 TSSOP40,.8,20 1,528 TSSOP48,.8,20 3,486 TSSOP56,.8,20 20 WAFER 60

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RECTANGULAR 19,749 SQUARE 499 UNSPECIFIED 515

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CHIP CARRIER 124 CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE 2 CHIP CARRIER, PIGGYBACK 136 CHIP SCALE 2 FLATPACK 107 FLATPACK, PIGGYBACK 68 GRID ARRAY 389 GRID ARRAY, FINE PITCH 619 GRID ARRAY, LOW PROFILE 38 GRID ARRAY, LOW PROFILE, FINE PITCH 223 GRID ARRAY, PIGGYBACK 68 GRID ARRAY, THIN PROFILE 39 GRID ARRAY, THIN PROFILE, FINE PITCH 1,833 GRID ARRAY, VERY THIN PROFILE 38 GRID ARRAY, VERY THIN PROFILE, FINE PITCH 612 IN-LINE 140 IN-LINE, PIGGYBACK 68 IN-LINE, WINDOW 2 MICROELECTRONIC ASSEMBLY 426 SMALL OUTLINE 5,434 SMALL OUTLINE, HEAT SINK/SLUG 1 SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE 384 SMALL OUTLINE, LOW PROFILE 2 SMALL OUTLINE, SHRINK PITCH 95 SMALL OUTLINE, THIN PROFILE 6,083 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH 2,791 SMALL OUTLINE, VERY THIN PROFILE 195 UNCASED CHIP 833

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128 words 11 128/256 words 124 16 words 1 1K words 2 256 words 6 2K words 33 4 words 59 4/8 words 10 64/128 words 38

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PARALLEL 19,070 PARALLEL/SERIAL 4 SERIAL 1,686

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Power Supplies (7)

1.8/2.2 V 60 3,3.3 V 4 3.3 V 53 3.3/5 V 48 3/3.3 V 163 3/5 V 48 5 V 181

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Sector Size (23)

(8,4,48,64,128)K 11 128K 64 16K 16 16K,1008K 122 16K,8K,32K,64K 6,951 16K,8K,64K 32 16K,8K,96K,128K 622 16K,8K,992K 156 1M 12 256K 3 2K 125 32K 12 4K 59 4K,32K 330 4K,64K 36 64K 857 64K,32K,8K,16K 2 8K,32K,64K 32 8K,488K 64 8K,4K,16K,32K 242 8K,4K,32K 2 8K,4K,48K,64K,128K 47 8K,64K 143

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Supply Voltage-Nom (Vsup) (10)

1.8 V 1,083 2 V 332 2.2 V 28 2.4 V 34 2.5 V 81 2.6 V 1 2.7 V 21 3 V 7,569 3.3 V 3,912 5 V 5,683

Min (V) - Max (V)

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