Findchips: Parametric Search Results for X25C R LGR

Parametric results for: X25C R LGR under Quartz Crystals

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		X25CA1-16.000MHZ MMD
		X25CA1-30.000MHZ-T MMD
		X25CC1-60.000MHZ-T MMD
		X25C02MG IC Microsystems Sdn Bhd
		X25C02MI IC Microsystems Sdn Bhd
		X25C02MT1 Xicor Inc
		X25C02S Xicor Inc
		X25CA1-20.000MHZ-T MMD
		X25CC1-16.000MHZ MMD
		X25C02SMG IC Microsystems Sdn Bhd

				Most Relevant								Technical			Compliance	Operating Conditions		Physical			Dimensions	Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Operating Frequency-Nom	Frequency Tolerance	Frequency Stability	Aging	Series Resistance	Load Capacitance	Physical Dimension	Operating Temperature-Max	Crystal/Resonator Type	Additional Feature	Drive Level	JESD-609 Code	Operating Temperature-Min	Operating Temperature-Max	Mounting Feature	Surface Mount	Terminal Finish	Physical Dimension	Ihs Manufacturer	Reach Compliance Code	HTS Code	Part Package Code	Package Description	Pin Count	ECCN Code	Clock Frequency-Max (fCLK)	JESD-30 Code	Length	Memory Density	Memory IC Type	Memory Width	Moisture Sensitivity Level	Number of Functions	Number of Terminals	Number of Words	Number of Words Code	Operating Mode	Organization	Package Body Material	Package Code	Package Shape	Package Style	Parallel/Serial	Peak Reflow Temperature (Cel)	Qualification Status	Seated Height-Max	Serial Bus Type	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Nom (Vsup)	Technology	Temperature Grade	Terminal Form	Terminal Pitch	Terminal Position	Width	Write Cycle Time-Max (tWC)	Data Retention Time-Min	Endurance	Package Equivalence Code	Standby Current-Max	Supply Current-Max	Write Protection	Output Characteristics

Check for Price

Yes

Transferred

16 MHz

15 ppm

0.003 %

2 PPM/YEAR

120 Ω

25 pF

L2.6XB2.1XH0.55 (mm)/L0.102XB0.083XH0.022 (inch)

70 °C

PARALLEL - FUNDAMENTAL

AT CUT

100 µW

70 °C

SURFACE MOUNT

YES

Gold (Au)

L2.6XB2.1XH0.55 (mm)/L0.102XB0.083XH0.022 (inch)

MMD COMPONENTS

compliant

8541.60.00.80

Check for Price

Yes

Transferred

30 MHz

15 ppm

0.003 %

2 PPM/YEAR

50 Ω

25 pF

L2.6XB2.1XH0.55 (mm)/L0.102XB0.083XH0.022 (inch)

70 °C

PARALLEL - FUNDAMENTAL

AT CUT; TR, 7 INCH

100 µW

70 °C

SURFACE MOUNT

YES

Gold (Au)

L2.6XB2.1XH0.55 (mm)/L0.102XB0.083XH0.022 (inch)

MMD COMPONENTS

compliant

8541.60.00.80

Check for Price

Yes

Transferred

60 MHz

15 ppm

0.003 %

2 PPM/YEAR

50 Ω

25 pF

L2.6XB2.1XH0.55 (mm)/L0.102XB0.083XH0.022 (inch)

85 °C

PARALLEL - FUNDAMENTAL

AT CUT; TR, 7 INCH

100 µW

-40 °C

85 °C

SURFACE MOUNT

YES

Gold (Au)

L2.6XB2.1XH0.55 (mm)/L0.102XB0.083XH0.022 (inch)

MMD COMPONENTS

compliant

8541.60.00.80

Check for Price

Yes

Obsolete

70 °C

YES

IC MICROSYSTEMS SDN BHD

unknown

8542.32.00.51

MSOP

TSSOP,

EAR99

1 MHz

S-PDSO-G8

3 mm

2.048 kbit

EEPROM

256 words

256

SYNCHRONOUS

256X8

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

SERIAL

260

Not Qualified

1.07 mm

SPI

5.5 V

4.5 V

5 V

CMOS

COMMERCIAL

GULL WING

650 µm

DUAL

3 mm

10 ms

Check for Price

Obsolete

85 °C

-40 °C

85 °C

YES

TIN LEAD

IC MICROSYSTEMS SDN BHD

unknown

8542.32.00.51

MSOP

TSSOP, TSSOP8,.19

EAR99

1 MHz

S-PDSO-G8

3 mm

2.048 kbit

EEPROM

256 words

256

SYNCHRONOUS

256X8

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

SERIAL

240

Not Qualified

1.07 mm

SPI

5.5 V

4.5 V

5 V

CMOS

INDUSTRIAL

GULL WING

650 µm

DUAL

3 mm

10 ms

100

100000 Write/Erase Cycles

TSSOP8,.19

150 µA

2 µA

HARDWARE/SOFTWARE

Check for Price

Obsolete

70 °C

YES

XICOR INC

unknown

MSOP-8

1 MHz

S-PDSO-G8

3 mm

2.048 kbit

EEPROM

256 words

256

SYNCHRONOUS

256X8

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

SERIAL

Not Qualified

1.07 mm

SPI

5.5 V

4.5 V

5 V

CMOS

COMMERCIAL

GULL WING

650 µm

DUAL

3 mm

10 ms

3-STATE

Check for Price

Obsolete

70 °C

3 WIRE SERIAL INTERFACE; SPI BUS INTERFACE

70 °C

YES

TIN LEAD

XICOR INC

unknown

PLASTIC, SOIC-8

1 MHz

R-PDSO-G8

4.9 mm

2.048 kbit

EEPROM

256 words

256

SYNCHRONOUS

256X8

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

SERIAL

Not Qualified

1.75 mm

SPI

5.5 V

4.5 V

5 V

CMOS

COMMERCIAL

GULL WING

1.27 mm

DUAL

3.9 mm

10 ms

100

100000 Write/Erase Cycles

SOP8,.25

150 µA

2 µA

HARDWARE/SOFTWARE

3-STATE

Check for Price

Yes

Transferred

20 MHz

15 ppm

0.003 %

2 PPM/YEAR

80 Ω

25 pF

L2.6XB2.1XH0.55 (mm)/L0.102XB0.083XH0.022 (inch)

70 °C

PARALLEL - FUNDAMENTAL

AT CUT; TR, 7 INCH

100 µW

70 °C

SURFACE MOUNT

YES

Gold (Au)

L2.6XB2.1XH0.55 (mm)/L0.102XB0.083XH0.022 (inch)

MMD COMPONENTS

compliant

8541.60.00.50

Check for Price

Yes

Transferred

16 MHz

15 ppm

0.003 %

2 PPM/YEAR

120 Ω

25 pF

L2.6XB2.1XH0.55 (mm)/L0.102XB0.083XH0.022 (inch)

85 °C

PARALLEL - FUNDAMENTAL

AT CUT

100 µW

-40 °C

85 °C

SURFACE MOUNT

YES

Gold (Au)

L2.6XB2.1XH0.55 (mm)/L0.102XB0.083XH0.022 (inch)

MMD COMPONENTS

compliant

8541.60.00.50

Check for Price

Yes

Obsolete

125 °C

-55 °C

125 °C

YES

IC MICROSYSTEMS SDN BHD

unknown

8542.32.00.51

SOIC

SOP,

3A001.A.2.C

1 MHz

R-PDSO-G8

4.9 mm

2.048 kbit

EEPROM

256 words

256

SYNCHRONOUS

256X8

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

SERIAL

260

Not Qualified

1.75 mm

SPI

5.5 V

4.5 V

5 V

CMOS

MILITARY

GULL WING

1.27 mm

DUAL

3.9 mm

10 ms

1 2 3 4 5 Next

Compare

X25CA1-16.000MHZ

MMD

Check for Price

Yes

Transferred

16 MHz

15 ppm

0.003 %

2 PPM/YEAR

120 Ω

25 pF

L2.6XB2.1XH0.55 (mm)/L0.102XB0.083XH0.022 (inch)

70 °C

PARALLEL - FUNDAMENTAL

AT CUT

100 µW

70 °C

SURFACE MOUNT

YES

Gold (Au)

L2.6XB2.1XH0.55 (mm)/L0.102XB0.083XH0.022 (inch)

MMD COMPONENTS

compliant

8541.60.00.80

X25CA1-30.000MHZ-T

MMD

Check for Price

Yes

Transferred

30 MHz

15 ppm

0.003 %

2 PPM/YEAR

50 Ω

25 pF

L2.6XB2.1XH0.55 (mm)/L0.102XB0.083XH0.022 (inch)

70 °C

PARALLEL - FUNDAMENTAL

AT CUT; TR, 7 INCH

100 µW

70 °C

SURFACE MOUNT

YES

Gold (Au)

L2.6XB2.1XH0.55 (mm)/L0.102XB0.083XH0.022 (inch)

MMD COMPONENTS

compliant

8541.60.00.80

X25CC1-60.000MHZ-T

MMD

Check for Price

Yes

Transferred

60 MHz

15 ppm

0.003 %

2 PPM/YEAR

50 Ω

25 pF

L2.6XB2.1XH0.55 (mm)/L0.102XB0.083XH0.022 (inch)

85 °C

PARALLEL - FUNDAMENTAL

AT CUT; TR, 7 INCH

100 µW

-40 °C

85 °C

SURFACE MOUNT

YES

Gold (Au)

L2.6XB2.1XH0.55 (mm)/L0.102XB0.083XH0.022 (inch)

MMD COMPONENTS

compliant

8541.60.00.80

X25C02MG

IC Microsystems Sdn Bhd

Check for Price

Yes

Obsolete

70 °C

YES

IC MICROSYSTEMS SDN BHD

unknown

8542.32.00.51

MSOP

TSSOP,

EAR99

1 MHz

S-PDSO-G8

3 mm

2.048 kbit

EEPROM

256 words

256

SYNCHRONOUS

256X8

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

SERIAL

260

Not Qualified

1.07 mm

SPI

5.5 V

4.5 V

5 V

CMOS

COMMERCIAL

GULL WING

650 µm

DUAL

3 mm

10 ms

X25C02MI

IC Microsystems Sdn Bhd

Check for Price

Obsolete

85 °C

-40 °C

85 °C

YES

TIN LEAD

IC MICROSYSTEMS SDN BHD

unknown

8542.32.00.51

MSOP

TSSOP, TSSOP8,.19

EAR99

1 MHz

S-PDSO-G8

3 mm

2.048 kbit

EEPROM

256 words

256

SYNCHRONOUS

256X8

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

SERIAL

240

Not Qualified

1.07 mm

SPI

5.5 V

4.5 V

5 V

CMOS

INDUSTRIAL

GULL WING

650 µm

DUAL

3 mm

10 ms

100

100000 Write/Erase Cycles

TSSOP8,.19

150 µA

2 µA

HARDWARE/SOFTWARE

X25C02MT1

Xicor Inc

Check for Price

Obsolete

70 °C

YES

XICOR INC

unknown

MSOP-8

1 MHz

S-PDSO-G8

3 mm

2.048 kbit

EEPROM

256 words

256

SYNCHRONOUS

256X8

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

SERIAL

Not Qualified

1.07 mm

SPI

5.5 V

4.5 V

5 V

CMOS

COMMERCIAL

GULL WING

650 µm

DUAL

3 mm

10 ms

3-STATE

X25C02S

Xicor Inc

Check for Price

Obsolete

70 °C

3 WIRE SERIAL INTERFACE; SPI BUS INTERFACE

70 °C

YES

TIN LEAD

XICOR INC

unknown

PLASTIC, SOIC-8

1 MHz

R-PDSO-G8

4.9 mm

2.048 kbit

EEPROM

256 words

256

SYNCHRONOUS

256X8

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

SERIAL

Not Qualified

1.75 mm

SPI

5.5 V

4.5 V

5 V

CMOS

COMMERCIAL

GULL WING

1.27 mm

DUAL

3.9 mm

10 ms

100

100000 Write/Erase Cycles

SOP8,.25

150 µA

2 µA

HARDWARE/SOFTWARE

3-STATE

X25CA1-20.000MHZ-T

MMD

Check for Price

Yes

Transferred

20 MHz

15 ppm

0.003 %

2 PPM/YEAR

80 Ω

25 pF

L2.6XB2.1XH0.55 (mm)/L0.102XB0.083XH0.022 (inch)

70 °C

PARALLEL - FUNDAMENTAL

AT CUT; TR, 7 INCH

100 µW

70 °C

SURFACE MOUNT

YES

Gold (Au)

L2.6XB2.1XH0.55 (mm)/L0.102XB0.083XH0.022 (inch)

MMD COMPONENTS

compliant

8541.60.00.50

X25CC1-16.000MHZ

MMD

Check for Price

Yes

Transferred

16 MHz

15 ppm

0.003 %

2 PPM/YEAR

120 Ω

25 pF

L2.6XB2.1XH0.55 (mm)/L0.102XB0.083XH0.022 (inch)

85 °C

PARALLEL - FUNDAMENTAL

AT CUT

100 µW

-40 °C

85 °C

SURFACE MOUNT

YES

Gold (Au)

L2.6XB2.1XH0.55 (mm)/L0.102XB0.083XH0.022 (inch)

MMD COMPONENTS

compliant

8541.60.00.50

X25C02SMG

IC Microsystems Sdn Bhd

Check for Price

Yes

Obsolete

125 °C

-55 °C

125 °C

YES

IC MICROSYSTEMS SDN BHD

unknown

8542.32.00.51

SOIC

SOP,

3A001.A.2.C

1 MHz

R-PDSO-G8

4.9 mm

2.048 kbit

EEPROM

256 words

256

SYNCHRONOUS

256X8

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

SERIAL

260

Not Qualified

1.75 mm

SPI

5.5 V

4.5 V

5 V

CMOS

MILITARY

GULL WING

1.27 mm

DUAL

3.9 mm

10 ms

1 2 3 4 5 Next