Filter Your Search
1 - 10 of 64 results
| Select Parts | Part Number | ||
|---|---|---|---|
|
|
TEA1062ANG-S16-R
Unisonic Technologies Co Ltd
|
||
|
|
TEA1062NL-S16-R
Unisonic Technologies Co Ltd
|
||
|
|
TEA1062(16SOP)
Unisonic Technologies Co Ltd
|
||
|
|
935083220118
NXP Semiconductors
|
||
|
|
935079230112
NXP Semiconductors
|
||
|
|
TEA1062A/C4/M1,112
NXP Semiconductors
|
||
|
|
TEA1062T/C4
NXP Semiconductors
|
||
|
|
TEA1062AT
NXP Semiconductors
|
||
|
|
TEA1062AT/C4,118
NXP Semiconductors
|
||
|
|
TEA1062AN
NXP Semiconductors
|
| Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Composite Price
|
Pbfree Code
|
Rohs Code
|
Part Life Cycle Code
|
Supply Voltage-Nom | Technology |
Telecom IC Type
|
Number of Functions |
Supply Current-Max
|
Temperature Grade
|
JESD-30 Code
|
JESD-609 Code
|
Qualification Status
|
Moisture Sensitivity Level
|
Operating Temperature-Max
|
Operating Temperature-Min
|
Peak Reflow Temperature (Cel)
|
Time@Peak Reflow Temperature-Max (s)
|
Number of Terminals
|
Package Body Material
|
Package Code
|
Package Equivalence Code
|
Package Shape
|
Package Style
|
Surface Mount
|
Terminal Finish
|
Terminal Form
|
Terminal Pitch
|
Terminal Position
|
Width
|
Length
|
Seated Height-Max
|
Ihs Manufacturer
|
Part Package Code
|
Package Description
|
Pin Count
|
Reach Compliance Code
|
HTS Code
|
Samacsys Manufacturer
|
| Yes | Active | 3.4 V | BIPOLAR | TELEPHONE DIALER CIRCUIT | 1 | 1.35 µA | COMMERCIAL EXTENDED | R-PDSO-G16 | Not Qualified | 75 °C | -25 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 3.95 mm | 10 mm | 1.96 mm | UNISONIC TECHNOLOGIES CO LTD | SOIC | SOP, SOP16,.25 | 16 | compliant | 8542.39.00.01 | ||||||
| Yes | Active | 3.4 V | BIPOLAR | TELEPHONE DIALER CIRCUIT | 1 | 1.35 µA | COMMERCIAL EXTENDED | R-PDSO-G16 | Not Qualified | 75 °C | -25 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 3.95 mm | 10 mm | 1.96 mm | UNISONIC TECHNOLOGIES CO LTD | SOIC | SOP, SOP16,.25 | 16 | compliant | 8542.39.00.01 | ||||||
| Active | 3.4 V | BIPOLAR | 1.35 mA | OTHER | R-PDSO-G16 | Not Qualified | 70 °C | -25 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | UNISONIC TECHNOLOGIES CO LTD | compliant | 8542.39.00.01 | |||||||||||||||||
| Yes | Yes | Active | 2.7 V | TELEPHONE SPEECH CIRCUIT | 1 | COMMERCIAL EXTENDED | R-PDSO-G16 | e4 | Not Qualified | 1 | 75 °C | -25 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 3.9 mm | 9.9 mm | 1.75 mm | NXP SEMICONDUCTORS | SOIC | PLASTIC, SOT-109, SO-16 | 16 | compliant | 8542.39.00.01 | |||||
| Yes | Obsolete | 2.7 V | TELEPHONE SPEECH CIRCUIT | 1 | COMMERCIAL EXTENDED | R-PDIP-T16 | e3 | Not Qualified | 75 °C | -25 °C | 16 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | TIN | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 38.1 mm | 4.32 mm | NXP SEMICONDUCTORS | DIP | DIP, | 16 | unknown | 8542.39.00.01 | |||||||||
| Yes | Yes | Active | 2.7 V | TELEPHONE SPEECH CIRCUIT | 1 | COMMERCIAL EXTENDED | R-PDIP-T16 | e4 | Not Qualified | 75 °C | -25 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | Nickel/Palladium/Gold (Ni/Pd/Au) | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 38.1 mm | 4.32 mm | NXP SEMICONDUCTORS | DIP | 0.300 INCH, PLASTIC, SOT-38, DIP-16 | 16 | compliant | 8542.39.00.01 | ||||||
| Yes | Yes | Active | 2.7 V | TELEPHONE SPEECH CIRCUIT | 1 | COMMERCIAL EXTENDED | R-PDSO-G16 | e4 | Not Qualified | 75 °C | -25 °C | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | NICKEL PALLADIUM GOLD | GULL WING | 1.27 mm | DUAL | 3.9 mm | 9.9 mm | 1.75 mm | NXP SEMICONDUCTORS | SOIC | PLASTIC, SOT-109, SO-16 | 16 | compliant | 8542.39.00.01 | ||||||||
| Yes | Obsolete | 3.4 V | BIPOLAR | TELEPHONE SPEECH CIRCUIT | 1 | 1.35 mA | COMMERCIAL EXTENDED | R-PDSO-G16 | Not Qualified | 75 °C | -25 °C | 260 | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 3.9 mm | 9.9 mm | 1.75 mm | NXP SEMICONDUCTORS | SOIC | SOP, SOP16,.25 | 16 | unknown | 8542.39.00.01 | NXP | ||||||
| Yes | Yes | Active | 2.7 V | BIPOLAR | TELEPHONE SPEECH CIRCUIT | 1 | 1.35 µA | COMMERCIAL EXTENDED | R-PDSO-G16 | e4 | Not Qualified | 1 | 75 °C | -25 °C | 260 | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | YES | NICKEL PALLADIUM GOLD | GULL WING | 1.27 mm | DUAL | 3.9 mm | 9.9 mm | 1.75 mm | NXP SEMICONDUCTORS | SOIC | PLASTIC, SO-16 | 16 | compliant | 8542.39.00.01 | NXP | ||
| Yes | Obsolete | 2.7 V | TELEPHONE SPEECH CIRCUIT | 1 | COMMERCIAL EXTENDED | R-PDIP-T16 | e3 | Not Qualified | 75 °C | -25 °C | 16 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | TIN | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 38.1 mm | 4.32 mm | NXP SEMICONDUCTORS | DIP | 0.300 INCH, PLASTIC, SOT-38, DIP-16 | 16 | unknown | 8542.39.00.01 | NXP |
|
|
TEA1062ANG-S16-R
Unisonic Technologies Co Ltd
|
Check for Price | Yes | Active | 3.4 V | BIPOLAR | TELEPHONE DIALER CIRCUIT | 1 | 1.35 µA | COMMERCIAL EXTENDED | R-PDSO-G16 | Not Qualified | 75 °C | -25 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 3.95 mm | 10 mm | 1.96 mm | UNISONIC TECHNOLOGIES CO LTD | SOIC | SOP, SOP16,.25 | 16 | compliant | 8542.39.00.01 | |||||||
|
|
TEA1062NL-S16-R
Unisonic Technologies Co Ltd
|
Check for Price | Yes | Active | 3.4 V | BIPOLAR | TELEPHONE DIALER CIRCUIT | 1 | 1.35 µA | COMMERCIAL EXTENDED | R-PDSO-G16 | Not Qualified | 75 °C | -25 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 3.95 mm | 10 mm | 1.96 mm | UNISONIC TECHNOLOGIES CO LTD | SOIC | SOP, SOP16,.25 | 16 | compliant | 8542.39.00.01 | |||||||
|
|
TEA1062(16SOP)
Unisonic Technologies Co Ltd
|
Check for Price | Active | 3.4 V | BIPOLAR | 1.35 mA | OTHER | R-PDSO-G16 | Not Qualified | 70 °C | -25 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | UNISONIC TECHNOLOGIES CO LTD | compliant | 8542.39.00.01 | ||||||||||||||||||
|
|
935083220118
NXP Semiconductors
|
Check for Price | Yes | Yes | Active | 2.7 V | TELEPHONE SPEECH CIRCUIT | 1 | COMMERCIAL EXTENDED | R-PDSO-G16 | e4 | Not Qualified | 1 | 75 °C | -25 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 3.9 mm | 9.9 mm | 1.75 mm | NXP SEMICONDUCTORS | SOIC | PLASTIC, SOT-109, SO-16 | 16 | compliant | 8542.39.00.01 | ||||||
|
|
935079230112
NXP Semiconductors
|
Check for Price | Yes | Obsolete | 2.7 V | TELEPHONE SPEECH CIRCUIT | 1 | COMMERCIAL EXTENDED | R-PDIP-T16 | e3 | Not Qualified | 75 °C | -25 °C | 16 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | TIN | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 38.1 mm | 4.32 mm | NXP SEMICONDUCTORS | DIP | DIP, | 16 | unknown | 8542.39.00.01 | ||||||||||
|
|
TEA1062A/C4/M1,112
NXP Semiconductors
|
Check for Price | Yes | Yes | Active | 2.7 V | TELEPHONE SPEECH CIRCUIT | 1 | COMMERCIAL EXTENDED | R-PDIP-T16 | e4 | Not Qualified | 75 °C | -25 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | Nickel/Palladium/Gold (Ni/Pd/Au) | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 38.1 mm | 4.32 mm | NXP SEMICONDUCTORS | DIP | 0.300 INCH, PLASTIC, SOT-38, DIP-16 | 16 | compliant | 8542.39.00.01 | |||||||
|
|
TEA1062T/C4
NXP Semiconductors
|
Check for Price | Yes | Yes | Active | 2.7 V | TELEPHONE SPEECH CIRCUIT | 1 | COMMERCIAL EXTENDED | R-PDSO-G16 | e4 | Not Qualified | 75 °C | -25 °C | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | NICKEL PALLADIUM GOLD | GULL WING | 1.27 mm | DUAL | 3.9 mm | 9.9 mm | 1.75 mm | NXP SEMICONDUCTORS | SOIC | PLASTIC, SOT-109, SO-16 | 16 | compliant | 8542.39.00.01 | |||||||||
|
|
TEA1062AT
NXP Semiconductors
|
Check for Price | Yes | Obsolete | 3.4 V | BIPOLAR | TELEPHONE SPEECH CIRCUIT | 1 | 1.35 mA | COMMERCIAL EXTENDED | R-PDSO-G16 | Not Qualified | 75 °C | -25 °C | 260 | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 3.9 mm | 9.9 mm | 1.75 mm | NXP SEMICONDUCTORS | SOIC | SOP, SOP16,.25 | 16 | unknown | 8542.39.00.01 | NXP | |||||||
|
|
TEA1062AT/C4,118
NXP Semiconductors
|
Check for Price | Yes | Yes | Active | 2.7 V | BIPOLAR | TELEPHONE SPEECH CIRCUIT | 1 | 1.35 µA | COMMERCIAL EXTENDED | R-PDSO-G16 | e4 | Not Qualified | 1 | 75 °C | -25 °C | 260 | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | YES | NICKEL PALLADIUM GOLD | GULL WING | 1.27 mm | DUAL | 3.9 mm | 9.9 mm | 1.75 mm | NXP SEMICONDUCTORS | SOIC | PLASTIC, SO-16 | 16 | compliant | 8542.39.00.01 | NXP | |||
|
|
TEA1062AN
NXP Semiconductors
|
Check for Price | Yes | Obsolete | 2.7 V | TELEPHONE SPEECH CIRCUIT | 1 | COMMERCIAL EXTENDED | R-PDIP-T16 | e3 | Not Qualified | 75 °C | -25 °C | 16 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | TIN | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 38.1 mm | 4.32 mm | NXP SEMICONDUCTORS | DIP | 0.300 INCH, PLASTIC, SOT-38, DIP-16 | 16 | unknown | 8542.39.00.01 | NXP |