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MR18R162WDG0-CM8
Samsung Semiconductor
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Check for Price | Yes | Obsolete | 9.6637 Gbit | 18 | 512MX18 | 2.5 V | 40 ns | 800 MHz | BLOCK ORIENTED PROTOCOL | RAMBUS DRAM MODULE | SELF CONTAINED REFRESH | COMMON | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 4.34 mA | 2.63 V | 2.37 V | CMOS | R-XDMA-N184 | Not Qualified | NOT SPECIFIED | NOT SPECIFIED | 184 | UNSPECIFIED | DIMM | DIMM184,40 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | 1 mm | DUAL | SAMSUNG SEMICONDUCTOR INC | DMA | DIMM, DIMM184,40 | 184 | compliant | EAR99 | 8542.32.00.36 | |||||||
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MR18R162WAG0-CM8
Samsung Semiconductor
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Check for Price | Obsolete | 9.6637 Gbit | 18 | 512MX18 | 2.5 V | BLOCK ORIENTED PROTOCOL | RAMBUS DRAM MODULE | SELF CONTAINED REFRESH | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | YES | 2.63 V | 2.37 V | CMOS | R-XDMA-N184 | Not Qualified | 184 | UNSPECIFIED | DIMM | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | DUAL | SAMSUNG SEMICONDUCTOR INC | DMA | DIMM, | 184 | unknown | EAR99 | 8542.32.00.36 | |||||||||||||||||
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MD18R326GAG0-CN1
Samsung Semiconductor
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Check for Price | Yes | Obsolete | 9.6637 Gbit | 36 | 256MX36 | 2.5 V | 32 ns | 600 MHz | 32768 | BLOCK ORIENTED PROTOCOL | RAMBUS DRAM MODULE | SELF CONTAINED REFRESH | COMMON | 1 | 1 | 256000000 | 268.4355 M | SYNCHRONOUS | 3-STATE | YES | 1.976 A | 4.27 mA | 2.63 V | 2.37 V | CMOS | COMMERCIAL | R-XDMA-N232 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 232 | UNSPECIFIED | DIMM | DIMM232,40 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | 1 mm | DUAL | SAMSUNG SEMICONDUCTOR INC | DMA | DIMM, DIMM232,40 | 232 | compliant | EAR99 | 8542.32.00.36 | |||
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MR18R326GAG0-CM8
Samsung Semiconductor
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Check for Price | Yes | Obsolete | 9.6637 Gbit | 18 | 512MX18 | 2.5 V | 40 ns | 800 MHz | BLOCK ORIENTED PROTOCOL | RAMBUS DRAM MODULE | SELF CONTAINED REFRESH | COMMON | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 2.755 mA | 2.63 V | 2.37 V | CMOS | R-XDMA-N184 | Not Qualified | 3 | 260 | 184 | UNSPECIFIED | DIMM | DIMM184,40 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | 1 mm | DUAL | SAMSUNG SEMICONDUCTOR INC | DMA | DIMM, DIMM184,40 | 184 | unknown | EAR99 | 8542.32.00.36 | |||||||
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MR18R162WEG0-CM8
Samsung Semiconductor
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Check for Price | Yes | Obsolete | 9.6637 Gbit | 18 | 512MX18 | 2.5 V | 40 ns | 800 MHz | BLOCK ORIENTED PROTOCOL | RAMBUS DRAM MODULE | SELF CONTAINED REFRESH | COMMON | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 4.765 mA | 2.63 V | 2.37 V | CMOS | R-XDMA-N184 | Not Qualified | 3 | 184 | UNSPECIFIED | DIMM | DIMM184,40 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | 1 mm | DUAL | SAMSUNG SEMICONDUCTOR INC | DMA | DIMM, DIMM184,40 | 184 | compliant | EAR99 | 8542.32.00.36 | ||||||||
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MD18R326GAG0-CM8
Samsung Semiconductor
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Check for Price | Yes | Obsolete | 9.6637 Gbit | 36 | 256MX36 | 2.5 V | 40 ns | 400 MHz | 32768 | BLOCK ORIENTED PROTOCOL | RAMBUS DRAM MODULE | SELF CONTAINED REFRESH | COMMON | 1 | 1 | 256000000 | 268.4355 M | SYNCHRONOUS | 3-STATE | YES | 1.496 A | 3.35 mA | 2.63 V | 2.37 V | CMOS | COMMERCIAL | R-XDMA-N232 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 232 | UNSPECIFIED | DIMM | DIMM232,40 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | 1 mm | DUAL | SAMSUNG SEMICONDUCTOR INC | DMA | DIMM, DIMM232,40 | 232 | compliant | EAR99 | 8542.32.00.36 | |||
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MR18R162WAG0-CK8
Samsung Semiconductor
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Check for Price | Obsolete | 9.6637 Gbit | 18 | 512MX18 | 2.5 V | BLOCK ORIENTED PROTOCOL | RAMBUS DRAM MODULE | SELF CONTAINED REFRESH | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | YES | 2.63 V | 2.37 V | CMOS | R-XDMA-N184 | Not Qualified | 184 | UNSPECIFIED | DIMM | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | DUAL | SAMSUNG SEMICONDUCTOR INC | DMA | DIMM, | 184 | unknown | EAR99 | 8542.32.00.36 | |||||||||||||||||
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MR18R162WDG0-CK8
Samsung Semiconductor
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Check for Price | Yes | Obsolete | 9.6637 Gbit | 18 | 512MX18 | 2.5 V | 45 ns | 800 MHz | BLOCK ORIENTED PROTOCOL | RAMBUS DRAM MODULE | SELF CONTAINED REFRESH | COMMON | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 4.34 mA | 2.63 V | 2.37 V | CMOS | R-XDMA-N184 | Not Qualified | NOT SPECIFIED | NOT SPECIFIED | 184 | UNSPECIFIED | DIMM | DIMM184,40 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | 1 mm | DUAL | SAMSUNG SEMICONDUCTOR INC | DMA | DIMM, DIMM184,40 | 184 | compliant | EAR99 | 8542.32.00.36 | |||||||
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MD18R326GAG0-CT9
Samsung Semiconductor
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Check for Price | Yes | Obsolete | 9.6637 Gbit | 36 | 256MX36 | 2.5 V | 32 ns | 533 MHz | 32768 | BLOCK ORIENTED PROTOCOL | RAMBUS DRAM MODULE | SELF CONTAINED REFRESH | COMMON | 1 | 1 | 256000000 | 268.4355 M | SYNCHRONOUS | 3-STATE | YES | 1.856 A | 4.1 mA | 2.63 V | 2.37 V | CMOS | COMMERCIAL | R-XDMA-N232 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 232 | UNSPECIFIED | DIMM | DIMM232,40 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | 1 mm | DUAL | SAMSUNG SEMICONDUCTOR INC | DMA | DIMM, DIMM232,40 | 232 | compliant | EAR99 | 8542.32.00.36 | |||
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MR18R326GAG0-CT9
Samsung Semiconductor
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Check for Price | Yes | Obsolete | 9.6637 Gbit | 18 | 512MX18 | 2.5 V | 32 ns | 1.066 GHz | BLOCK ORIENTED PROTOCOL | RAMBUS DRAM MODULE | SELF CONTAINED REFRESH | COMMON | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 3.33 mA | 2.63 V | 2.37 V | CMOS | R-XDMA-N184 | Not Qualified | 3 | 260 | 184 | UNSPECIFIED | DIMM | DIMM184,40 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | 1 mm | DUAL | SAMSUNG SEMICONDUCTOR INC | DMA | DIMM, DIMM184,40 | 184 | unknown | EAR99 | 8542.32.00.36 |