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PM4351-RGI
Microchip Technology Inc
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$27.9441 | Yes | Active | 3.3 V | CMOS | FRAMER | 1 | INDUSTRIAL | S-PBGA-B81 | e3 | 85 °C | -40 °C | 81 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | MATTE TIN | BALL | BOTTOM | MICROCHIP TECHNOLOGY INC | CABGA-81 | compliant | 5A991.B | 8542.31.00.01 | Microchip | |||||||||||||
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PM4351-RI
PMC-Sierra Inc
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Check for Price | No | Transferred | 3.3 V | CMOS | CEPT PCM-30/E-1 | FRAMER | T-1(DS1) | 1 | INDUSTRIAL | S-PQFP-G80 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 80 | PLASTIC/EPOXY | QFP | QFP80,.7SQ | SQUARE | FLATPACK | YES | TIN LEAD | GULL WING | 650 µm | QUAD | 14 mm | 14 mm | 2.35 mm | PMC-SIERRA INC | 14 X 14 MM, 2 MM HEIGHT, METRIC, PLASTIC, QFP-80 | compliant | 8542.39.00.01 | ||||||
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PM4351-RGI
PMC-Sierra Inc
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Check for Price | Yes | Transferred | 3.3 V | CMOS | CEPT PCM-30/E-1 | FRAMER | T-1(DS1) | 1 | INDUSTRIAL | S-PQFP-G80 | Not Qualified | 3 | 85 °C | -40 °C | 80 | PLASTIC/EPOXY | QFP | QFP80,.7SQ | SQUARE | FLATPACK | YES | GULL WING | 650 µm | QUAD | 14 mm | 14 mm | 2.35 mm | PMC-SIERRA INC | QFP, QFP80,.7SQ | compliant | 8542.39.00.01 | ||||||||
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PM4351-RI
Microsemi Corporation
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Check for Price | No | Transferred | 3.3 V | CMOS | CEPT PCM-30/E-1 | FRAMER | T-1(DS1) | 1 | INDUSTRIAL | S-PQFP-G80 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 80 | PLASTIC/EPOXY | QFP | QFP80,.7SQ | SQUARE | FLATPACK | YES | TIN LEAD | GULL WING | 650 µm | QUAD | 14 mm | 14 mm | 2.35 mm | MICROSEMI CORP | 14 X 14 MM, 2 MM HEIGHT, METRIC, PLASTIC, QFP-80 | unknown | 8542.39.00.01 | Microsemi Corporation | |||||
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PM4351-NI
PMC-Sierra Inc
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Check for Price | No | Transferred | 3.3 V | CMOS | CEPT PCM-30/E-1 | FRAMER | T-1(DS1) | 1 | INDUSTRIAL | S-PBGA-B81 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 81 | PLASTIC/EPOXY | LFBGA | BGA81,9X9,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 9 mm | 9 mm | 1.5 mm | PMC-SIERRA INC | 9 X 9 MM, 1.40 MM HEIGHT, CABGA-81 | compliant | 8542.39.00.01 | ||||||
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PM4351-NI
Microsemi Corporation
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Check for Price | No | Transferred | 3.3 V | CMOS | CEPT PCM-30/E-1 | FRAMER | T-1(DS1) | 1 | INDUSTRIAL | S-PBGA-B81 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 81 | PLASTIC/EPOXY | LFBGA | BGA81,9X9,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 9 mm | 9 mm | 1.5 mm | MICROSEMI CORP | 9 X 9 MM, 1.40 MM HEIGHT, CABGA-81 | not_compliant | 8542.39.00.01 | ||||||
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PM4351-NGI
PMC-Sierra Inc
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Check for Price | Yes | Transferred | 3.3 V | CMOS | CEPT PCM-30/E-1 | FRAMER | T-1(DS1) | 1 | INDUSTRIAL | S-PBGA-B81 | e1 | Not Qualified | 3 | 85 °C | -40 °C | 81 | PLASTIC/EPOXY | LFBGA | BGA81,9X9,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 9 mm | 9 mm | 1.5 mm | PMC-SIERRA INC | 9 X 9 MM, 1.40 MM HEIGHT, CABGA-81 | compliant | 8542.39.00.01 | ||||||
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PM4351-NI
Microchip Technology Inc
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Check for Price | No | Obsolete | 3.3 V | CMOS | CEPT PCM-30/E-1 | FRAMER | T-1(DS1) | 1 | INDUSTRIAL | S-PBGA-B81 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 81 | PLASTIC/EPOXY | LFBGA | BGA81,9X9,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 9 mm | 9 mm | 1.5 mm | MICROCHIP TECHNOLOGY INC | 9 X 9 MM, 1.40 MM HEIGHT, CABGA-81 | compliant | |||||||
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PM4351-RI
Microchip Technology Inc
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Check for Price | No | Obsolete | 3.3 V | CMOS | CEPT PCM-30/E-1 | FRAMER | T-1(DS1) | 1 | INDUSTRIAL | S-PQFP-G80 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 80 | PLASTIC/EPOXY | QFP | QFP80,.7SQ | SQUARE | FLATPACK | YES | TIN LEAD | GULL WING | 650 µm | QUAD | 14 mm | 14 mm | 2.35 mm | MICROCHIP TECHNOLOGY INC | 14 X 14 MM, 2 MM HEIGHT, METRIC, PLASTIC, QFP-80 | compliant | Microchip | ||||||
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PM4351-NGI
Microchip Technology Inc
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Check for Price | Yes | Obsolete | 3.3 V | CMOS | CEPT PCM-30/E-1 | FRAMER | T-1(DS1) | 1 | INDUSTRIAL | S-PBGA-B81 | e1 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 81 | PLASTIC/EPOXY | LFBGA | BGA81,9X9,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 9 mm | 9 mm | 1.5 mm | MICROCHIP TECHNOLOGY INC | 9 X 9 MM, 1.40 MM HEIGHT, CABGA-81 | compliant |