Parametric results for: LB W5SM-FYGZ-24 under SRAMs

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Package Code: LBGA
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CY7C1314KV18-250BZXI
Cypress Semiconductor
$4.2525 Yes Transferred 18.8744 Mbit 36 512KX36 1.8 V 450 ps QDR SRAM PIPELINED ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 1.9 V 1.7 V CMOS INDUSTRIAL R-PBGA-B165 e1 3 85 °C -40 °C 260 30 165 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm CYPRESS SEMICONDUCTOR CORP FBGA-165 compliant 3A991.B.2.A 8542.32.00.41
CY7C1312KV18-250BZXI
Cypress Semiconductor
$4.8600 Yes Transferred 18.8744 Mbit 18 1MX18 1.8 V 450 ps 250 MHz QDR SRAM PIPELINED ARCHITECTURE SEPARATE 1 1000000 1.0486 M SYNCHRONOUS 3-STATE PARALLEL 250 mA 1.7 V 560 µA 1.9 V 1.7 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e1 3 85 °C -40 °C 260 30 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm CYPRESS SEMICONDUCTOR CORP 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 compliant 3A991 8542.32.00.41 BGA 165
CY7C1314KV18-250BZI
Cypress Semiconductor
$5.3258 No Transferred 18.8744 Mbit 36 512KX36 1.8 V 450 ps 250 MHz QDR SRAM PIPELINED ARCHITECTURE SEPARATE 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 250 mA 1.7 V 670 µA 1.9 V 1.7 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e0 3 85 °C -40 °C 220 20 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm CYPRESS SEMICONDUCTOR CORP 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 compliant 3A991.B.2.A 8542.32.00.41 BGA 165
GS88132CGD-150I
GSI Technology
$8.8549 Yes Active 8.3886 Mbit 32 256KX32 3.3 V 7.5 ns CACHE SRAM ALSO OPERATES WITH 2.3V TO 2.7V SUPPLY, FLOW THROUGH OR PIPELINED ARCHITECTURE 1 256000 262.144 k SYNCHRONOUS SERIAL 3.6 V 3 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 165 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm GSI TECHNOLOGY LBGA, compliant 3A991.B.2.B 8542.32.00.41 BGA 165
GS88236CGD-200I
GSI Technology
$8.8549 Yes Yes Active 9.4372 Mbit 36 256KX36 2.5 V 6.5 ns CACHE SRAM PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY 1 256000 262.144 k SYNCHRONOUS PARALLEL 2.7 V 2.3 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e1 3 85 °C -40 °C 260 165 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm GSI TECHNOLOGY LBGA, compliant 3A991.B.2.B 8542.32.00.41 BGA 165
GS88118CGD-150I
GSI Technology
$8.8738 Yes Active 9.4372 Mbit 18 512KX18 3.3 V 7.5 ns CACHE SRAM ALSO OPERATES WITH 2.3V TO 2.7V SUPPLY, FLOW THROUGH OR PIPELINED ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS SERIAL 3.6 V 3 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 165 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm GSI TECHNOLOGY LBGA, compliant 3A991.B.2.B 8542.32.00.41 BGA 165 GSI TECHNOLOGY
GS88136CD-250I
GSI Technology
$10.0516 No Active 9.4372 Mbit 36 256KX36 3.3 V 5.5 ns CACHE SRAM ALSO OPERATES WITH 2.3V TO 2.7V SUPPLY, FLOW THROUGH OR PIPELINED ARCHITECTURE 1 256000 262.144 k SYNCHRONOUS SERIAL 3.6 V 3 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 165 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm GSI TECHNOLOGY LBGA, compliant 3A991.B.2.B 8542.32.00.41 BGA 165
GS816118DGD-200
GSI Technology
$12.3069 Yes Active 18.8744 Mbit 18 1MX18 2.5 V 6.5 ns CACHE SRAM FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V 1 1000000 1.0486 M SYNCHRONOUS PARALLEL 2.7 V 2.3 V CMOS COMMERCIAL R-PBGA-B165 70 °C NOT SPECIFIED NOT SPECIFIED 165 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm GSI TECHNOLOGY LBGA, compliant 3A991.B.2.B 8542.32.00.41 BGA 165
GS8162Z18DD-200I
GSI Technology
$13.1168 No Active 18.8744 Mbit 18 1MX18 2.5 V 6.5 ns ZBT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY 1 1000000 1.0486 M SYNCHRONOUS PARALLEL 2.7 V 2.3 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e0 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 165 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm GSI TECHNOLOGY LBGA, compliant 3A991.B.2.B 8542.32.00.41 BGA 165
GS8182Q18BGD-200I
GSI Technology
$13.4168 Yes Yes End Of Life 18.8744 Mbit 18 1MX18 1.8 V 450 ps DDR SRAM PIPELINED ARCHITECTURE 1 1000000 1.0486 M SYNCHRONOUS PARALLEL 1.9 V 1.7 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e1 3 85 °C -40 °C 260 165 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm GSI TECHNOLOGY LBGA, compliant 3A991.B.2.B 8542.32.00.41 BGA 165