Parametric results for: JANTX 1N5811 under Rectifier Diodes
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JAN1N5811
Semtech Corporation
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$1.0000 | Transferred | 6 A | 875 mV | 30 ns | 5 µA | SILICON | RECTIFIER DIODE | SINGLE | NO | 150 V | 1 | SUPER FAST RECOVERY | 125 A | 1 | Qualified | O-LALF-W2 | MIL-19500/477 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | SEMTECH CORP | G112, 2 PIN | 2 | G112 | unknown | EAR99 | 8541.10.00.80 | SEMTECH | |||||||||||
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1N5811
Solid State Devices Inc (SSDI)
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$4.4660 | Active | 6 A | 875 mV | 40 ns | SILICON | RECTIFIER DIODE | SINGLE | NO | 150 V | 1 | HYPER ULTRA FAST RECOVERY | 1 | Not Qualified | 175 °C | SOLID STATE DEVICES INC | compliant | EAR99 | ||||||||||||||||||||||||||||
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JANTX1N5811
Microsemi Corporation
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$5.0313 | No | No | Transferred | 3 A | 30 ns | SILICON | RECTIFIER DIODE | SINGLE | NO | 150 V | 1 | HIGH RELIABILITY, METALLURGICALLY BONDED | ULTRA FAST RECOVERY | 125 A | 1 | Not Qualified | O-LALF-W2 | e0 | MIL-19500 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | 2 | not_compliant | EAR99 | 8541.10.00.80 | Microsemi Corporation | |||||||||
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1N5811US
Microsemi Corporation
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$5.0708 | No | No | Transferred | 3 A | 30 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 150 V | 1 | HIGH RELIABILITY, METALLURGICALLY BONDED | ULTRA FAST RECOVERY | 125 A | 1 | O-LELF-R2 | e0 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD OVER NICKEL | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS, MELF-2 | 2 | not_compliant | EAR99 | 8541.10.00.80 | Microsemi Corporation | MELF | ||||||||||
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1N5811
Sensitron Semiconductors
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$5.1329 | No | No | Active | 6 A | 925 mV | 30 ns | 5 µA | SILICON | RECTIFIER DIODE | SINGLE | NO | 150 V | 1 | HIGH RELIABILITY, METALLURGICALLY BONDED | ULTRA FAST RECOVERY | 125 A | 1 | Not Qualified | O-LALF-W2 | e0 | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | SENSITRON SEMICONDUCTOR | HERMETIC SEALED, GLASS PACKAGE-2 | 2 | compliant | EAR99 | 8541.10.00.80 | ||||||||
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1N5811C.TR
Semtech Corporation
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$5.6153 | Transferred | 6 A | 875 mV | 30 ns | 5 µA | SILICON | RECTIFIER DIODE | SINGLE | NO | 150 V | 1 | HIGH RELIABILITY | SUPER FAST RECOVERY | 125 A | 1 | 150 V | E-XALF-W2 | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ELLIPTICAL | LONG FORM | WIRE | AXIAL | SEMTECH CORP | unknown | EAR99 | 8541.10.00.80 | SEMTECH | ||||||||||||||
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1N5811US
Sensitron Semiconductors
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$6.5963 | No | No | Active | 6 A | 925 mV | 30 ns | 5 µA | SILICON | RECTIFIER DIODE | SINGLE | YES | 150 V | 1 | HIGH RELIABILITY, METALLURGICALLY BONDED | ULTRA FAST RECOVERY | 125 A | 1 | Not Qualified | E-LELF-R2 | e0 | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ELLIPTICAL | LONG FORM | TIN LEAD | WRAP AROUND | END | SENSITRON SEMICONDUCTOR | MELF-B, 2 PIN | 2 | compliant | EAR99 | 8541.10.00.80 | MELF | |||||||
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JAN1N5811
Microchip Technology Inc
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$6.6802 | No | Active | 6 A | 875 mV | 30 ns | 5 W | SILICON | RECTIFIER DIODE | SINGLE | NO | 150 V | 1 | HIGH RELIABILITY, METALLURGICALLY BONDED | ULTRA FAST RECOVERY POWER | 125 A | 1 | Qualified | O-XALF-W2 | e0 | MIL-19500 | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD OVER NICKEL | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | compliant | Microchip | ||||||||||||
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1N5811
Microchip Technology Inc
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$7.2326 | No | Active | 3 A | 30 ns | SILICON | RECTIFIER DIODE | SINGLE | NO | 150 V | 1 | HIGH RELIABILITY, METALLURGICALLY BONDED | ULTRA FAST RECOVERY | 125 A | 1 | O-LALF-W2 | e0 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | Microchip | |||||||||||||||
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1N5811US
Microchip Technology Inc
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$7.3654 | No | Active | 3 A | 30 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 150 V | 1 | HIGH RELIABILITY, METALLURGICALLY BONDED | ULTRA FAST RECOVERY | 125 A | 1 | O-LELF-R2 | e0 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD OVER NICKEL | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, MELF-2 | compliant | Microchip |