Parametric results for: FR 3392 under Digital Transmission Controllers
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DS2154L
Maxim Integrated Products
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$3.2639 | No | No | Obsolete | 5 V | CMOS | CEPT PCM-30/E-1 | FRAMER | 1 | COMMERCIAL | S-PQFP-G100 | e0 | Not Qualified | 3 | 70 °C | 240 | 20 | 100 | PLASTIC/EPOXY | LFQFP | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | Tin/Lead (Sn/Pb) | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | MAXIM INTEGRATED PRODUCTS INC | QFP | 14 X 14 MM, 1.40 MM HEIGHT, LQFP-100 | 100 | not_compliant | EAR99 | 8542.39.00.01 | ||||||
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MT9076BB1
Microchip Technology Inc
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$22.3829 | Yes | Obsolete | 3.3 V | FRAMER | 1 | 98 mA | INDUSTRIAL | S-PQFP-G80 | e3 | Not Qualified | 85 °C | -40 °C | 80 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 650 µm | QUAD | 14 mm | 14 mm | 1.6 mm | MICROCHIP TECHNOLOGY INC | 14 X 14 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026BEC, LQFP-80 | compliant | Microchip | ||||||||||||||
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PM4351-RGI
Microchip Technology Inc
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$27.9441 | Yes | Active | 3.3 V | CMOS | FRAMER | 1 | INDUSTRIAL | S-PBGA-B81 | e3 | 85 °C | -40 °C | 81 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | MATTE TIN | BALL | BOTTOM | MICROCHIP TECHNOLOGY INC | CABGA-81 | compliant | 5A991.B | 8542.31.00.01 | Microchip | |||||||||||||||||
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82V2108PXG
Integrated Device Technology Inc
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$38.2973 | Yes | Yes | Transferred | 3.3 V | CMOS | FRAMER | 1 | INDUSTRIAL | R-PQFP-G128 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 128 | PLASTIC/EPOXY | FQFP | QFP128,.67X.93,20 | RECTANGULAR | FLATPACK, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 20 mm | 3.4 mm | INTEGRATED DEVICE TECHNOLOGY INC | PQFP | GREEN, PLASTIC, QFP-128 | 128 | compliant | EAR99 | 8542.39.00.01 | PXG128 | |||||
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PM4358-NGI
Microchip Technology Inc
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$42.8457 | Active | 1.8 V | CMOS | FRAMER | 1 | INDUSTRIAL | S-PBGA-B256 | 3 | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | BOTTOM | MICROCHIP TECHNOLOGY INC | BGA, | compliant | 5A991.B | 8542.31.00.01 | Microchip | |||||||||||||||||||
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DS34T108GN+
Maxim Integrated Products
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$109.5445 | Yes | Yes | Transferred | 1.8 V | FRAMER | 1 | 550 µA | INDUSTRIAL | S-PBGA-B484 | e1 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 484 | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 23 mm | 23 mm | 2.41 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | BGA, BGA484,22X22,40 | 484 | compliant | EAR99 | 8542.39.00.01 | ||||||
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PM8318-FXI
Microchip Technology Inc
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$485.4540 | Active | CMOS | FRAMER | 1 | S-PBGA-B480 | 480 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | BOTTOM | MICROCHIP TECHNOLOGY INC | BBGA-480 | compliant | 5A991.B | 8542.31.00.01 | |||||||||||||||||||||||||
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PM8310A-FEI
Microchip Technology Inc
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$791.6142 | Yes | Active | FRAMER | 1 | INDUSTRIAL | S-PBGA-B896 | 85 °C | -40 °C | 896 | PLASTIC/EPOXY | SQUARE | YES | BALL | BOTTOM | MICROCHIP TECHNOLOGY INC | HBBGA-896 | compliant | Microchip | |||||||||||||||||||||||||
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PM5326-FEI
Microchip Technology Inc
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$1,035.9586 | Active | 1.2 V | FRAMER | 1 | S-PBGA-B1292 | 1292 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | BOTTOM | MICROCHIP TECHNOLOGY INC | FCBGA-1292 | compliant | 5A991.B | 8542.31.00.01 | |||||||||||||||||||||||||
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BT8071AKPQ
Conexant Systems Inc
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Check for Price | No | Obsolete | 5 V | CMOS | FRAMER | 1 | COMMERCIAL | R-PQIP-T64 | e0 | Not Qualified | 70 °C | 64 | PLASTIC/EPOXY | QIP | QUIP64A,.7/.9 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 1.27 mm | QUAD | BROOKTREE CORP | QIP, QUIP64A,.7/.9 | unknown | 8542.39.00.01 |