Parametric results for: FPSLIC - Application Note... under SRAMs

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Memory IC Type: APPLICATION SPECIFIC SRAM
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IS61WV12816DBLL-10TLI-TR
Integrated Silicon Solution Inc
$0.6944 Yes Yes Active 2.0972 Mbit 16 128KX16 3 V 10 ns APPLICATION SPECIFIC SRAM COMMON 1 128000 131.072 k ASYNCHRONOUS 3-STATE PARALLEL 70 µA 2 V 65 µA 3.6 V 2.4 V CMOS INDUSTRIAL R-PDSO-G44 Not Qualified e3 1 85 °C -40 °C 44 PLASTIC/EPOXY TSOP2 TSOP44,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES Matte Tin (Sn) GULL WING 800 µm DUAL 1.2 mm 18.415 mm 10.16 mm INTEGRATED SILICON SOLUTION INC TSOP2, TSOP44,.46,32 compliant 3A991.B.2.A 8542.32.00.41 Integrated Silicon Solution Inc.
IS61WV25616EDBLL-10BLI-TR
Integrated Silicon Solution Inc
$1.0060 Yes Yes Active 4.1943 Mbit 16 256KX16 3 V 10 ns APPLICATION SPECIFIC SRAM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 6 mA 2 V 35 µA 3.6 V 2.4 V CMOS INDUSTRIAL R-PBGA-B48 Not Qualified e3 1 85 °C -40 °C 48 PLASTIC/EPOXY TFBGA BGA48,6X8,30 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Matte Tin (Sn) BALL 750 µm BOTTOM 1.2 mm 8 mm 6 mm INTEGRATED SILICON SOLUTION INC TFBGA, BGA48,6X8,30 compliant 3A991.B.2.A 8542.32.00.41 Integrated Silicon Solution Inc.
IS61WV25616EDBLL-8TLI-TR
Integrated Silicon Solution Inc
$2.1692 Yes Yes Active 4.1943 Mbit 16 256KX16 3 V 8 ns APPLICATION SPECIFIC SRAM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 6 mA 2 V 45 µA 3.6 V 2.4 V CMOS INDUSTRIAL R-PDSO-G44 Not Qualified e3 1 85 °C -40 °C 44 PLASTIC/EPOXY TSOP2 TSOP44,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES Matte Tin (Sn) GULL WING 800 µm DUAL 1.2 mm 18.41 mm 10.16 mm INTEGRATED SILICON SOLUTION INC TSOP2, TSOP44,.46,32 compliant 3A991.B.2.A 8542.32.00.41 Integrated Silicon Solution Inc.
IS61WV25616EDBLL-10BLI
Integrated Silicon Solution Inc
$3.3867 Yes Yes Active 16.7772 Mbit 16 1MX16 3 V 10 ns APPLICATION SPECIFIC SRAM COMMON 1 1000000 1.0486 M ASYNCHRONOUS 3-STATE PARALLEL 6 mA 2 V 35 µA 3.6 V 2.4 V CMOS INDUSTRIAL R-PBGA-B48 Not Qualified e3 1 85 °C -40 °C 48 PLASTIC/EPOXY TFBGA BGA48,6X8,30 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Matte Tin (Sn) BALL 750 µm BOTTOM 1.2 mm 8 mm 6 mm INTEGRATED SILICON SOLUTION INC TFBGA, BGA48,6X8,30 compliant 3A991.B.2.A 8542.32.00.41 Integrated Silicon Solution Inc.
IS61WV25616EDBLL-8TLI
Integrated Silicon Solution Inc
$4.0541 Yes Yes Active 4.1943 Mbit 16 256KX16 3.3 V 8 ns APPLICATION SPECIFIC SRAM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 6 mA 2 V 45 µA 3.63 V 2.97 V CMOS INDUSTRIAL R-PDSO-G44 Not Qualified e3 1 85 °C -40 °C 44 PLASTIC/EPOXY TSOP2 TSOP44,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES Matte Tin (Sn) GULL WING 800 µm DUAL 1.2 mm 18.41 mm 10.16 mm INTEGRATED SILICON SOLUTION INC TSOP2, TSOP44,.46,32 compliant 3A991.B.2.A 8542.32.00.41 Integrated Silicon Solution Inc.
IS61WV25616EDBLL-8BLI
Integrated Silicon Solution Inc
$5.1893 Yes Yes Active 4.1943 Mbit 16 256KX16 3.3 V 8 ns APPLICATION SPECIFIC SRAM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 6 mA 2 V 45 µA 3.63 V 2.97 V CMOS INDUSTRIAL R-PBGA-B48 Not Qualified e3 1 85 °C -40 °C 48 PLASTIC/EPOXY TFBGA BGA48,6X8,30 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Matte Tin (Sn) BALL 750 µm BOTTOM 1.2 mm 8 mm 6 mm INTEGRATED SILICON SOLUTION INC TFBGA, BGA48,6X8,30 compliant 3A991.B.2.A 8542.32.00.41 Integrated Silicon Solution Inc.
70V3399S133BF
Integrated Device Technology Inc
$73.7305 No No Transferred 2.3593 Mbit 18 128KX18 3.3 V 4.2 ns 133 MHz APPLICATION SPECIFIC SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 400 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY BGA BGA208,17X17,32 SQUARE GRID ARRAY YES TIN LEAD BALL 800 µm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC FPBGA-208 not_compliant 3A991.B.2.A 8542.32.00.41 CABGA 208 BF208
UPD42101G-1
NEC Electronics America Inc
Check for Price Obsolete 7.28 kbit 8 910X8 5 V 49 ns APPLICATION SPECIFIC SRAM LINE BUFFER FOR NTSC TV 1 1 910 910 words ASYNCHRONOUS NO PARALLEL 5.5 V 4.5 V CMOS COMMERCIAL R-PDSO-G24 Not Qualified 70 °C 24 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 2.5 mm 8.4 mm NEC ELECTRONICS AMERICA INC 0.450 INCH, PLASTIC, SOP-24 unknown EAR99 8542.32.00.41
MCM67P618FN12
Motorola Mobility LLC
Check for Price No No Obsolete 1.1796 Mbit 18 64KX18 5 V 12 ns APPLICATION SPECIFIC SRAM SELF-TIMED WRITE; BYTE WRITE; ASYN OR SYN MODE OF OPERATION COMMON 1 1 64000 65.536 k SYNCHRONOUS 3-STATE YES PARALLEL 270 µA 5.5 V 4.5 V BICMOS COMMERCIAL S-PQCC-J52 Not Qualified e0 70 °C 52 PLASTIC/EPOXY QCCJ LDCC52,.8SQ SQUARE CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 4.57 mm 19.1262 mm 19.1262 mm MOTOROLA INC QCCJ, LDCC52,.8SQ unknown 3A991.B.2.A 8542.32.00.41 LCC 52
70V5388S100BGI
Integrated Device Technology Inc
Check for Price No No Obsolete 1.1796 Mbit 18 64KX18 3.3 V 3.6 ns 100 MHz APPLICATION SPECIFIC SRAM PIPELINED ARCHITECTURE COMMON 1 4 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 3.15 V 245 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B272 Not Qualified e0 3 85 °C -40 °C 225 30 272 PLASTIC/EPOXY BGA BGA272,20X20,50 SQUARE GRID ARRAY YES Tin/Lead (Sn63Pb37) BALL 1.27 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC 27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, BGA-272 not_compliant 3A991.B.2.A 8542.32.00.41