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Manufacturer Part Number: 70t633s12bf
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70T633S12BFI8
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 18 512KX18 2.5 V 12 ns MULTI-PORT SRAM COMMON 1 2 512000 524.288 k ASYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 395 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.5 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-208 208 BF208 not_compliant 3A991.B.2.A 8542.32.00.41
70T633S12BFG
 Integrated Device Technology Inc 		Check for Price Yes Yes Obsolete 9.4372 Mbit 18 512KX18 2.5 V 12 ns MULTI-PORT SRAM COMMON 1 2 512000 524.288 k ASYNCHRONOUS 3-STATE PARALLEL 10 mA 2.4 V 355 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e1 3 70 °C 260 30 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA FBGA-208 208 compliant 3A991.B.2.A 8542.32.00.41
70T633S12BF
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 18 512KX18 2.5 V 12 ns MULTI-PORT SRAM COMMON 1 2 512000 524.288 k ASYNCHRONOUS 3-STATE PARALLEL 10 mA 2.4 V 355 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.5 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-208 208 BF208 not_compliant 3A991.B.2.A 8542.32.00.41
70T633S12BFI
 Renesas Electronics Corporation 		Check for Price No No Active 9.4372 Mbit 18 512KX18 2.5 V 12 ns MULTI-PORT SRAM COMMON 1 2 512000 524.288 k ASYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 395 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.5 mm 15 mm 15 mm RENESAS ELECTRONICS CORP CABGA 208 BF208 not_compliant NLR 8542320041 Renesas Electronics
IDT70T633S12BFI8
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 18 512KX18 2.5 V 12 ns MULTI-PORT SRAM COMMON 1 2 512000 524.288 k ASYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 395 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.5 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LFBGA, BGA208,17X17,32 208 not_compliant 3A991.B.2.A 8542.32.00.41
IDT70T633S12BFG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Obsolete 9.4372 Mbit 18 512KX18 12 ns MULTI-PORT SRAM COMMON 2 512000 524.288 k ASYNCHRONOUS 3-STATE PARALLEL 10 mA 2.4 V 355 µA CMOS COMMERCIAL S-PBGA-B208 Not Qualified e1 3 70 °C 260 30 208 PLASTIC/EPOXY FBGA BGA208,17X17,32 SQUARE GRID ARRAY, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC unknown 3A991.B.2.A 8542.32.00.41
70T633S12BFG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Obsolete 9.4372 Mbit 18 512KX18 2.5 V 12 ns MULTI-PORT SRAM COMMON 1 2 512000 524.288 k ASYNCHRONOUS 3-STATE PARALLEL 10 mA 2.4 V 355 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e1 3 70 °C 260 30 208 PLASTIC/EPOXY BGA BGA208,17X17,32 SQUARE GRID ARRAY YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC FBGA-208 compliant 3A991.B.2.A 8542.32.00.41
IDT70T633S12BFG
 Integrated Device Technology Inc 		Check for Price Yes Yes Obsolete 9.4372 Mbit 18 512KX18 2.5 V 12 ns MULTI-PORT SRAM COMMON 1 2 512000 524.288 k ASYNCHRONOUS 3-STATE PARALLEL 10 mA 2.4 V 355 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e1 3 70 °C 260 30 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.5 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 15 X 15 MM, 1.40 MM HIEGHT, 0.80 MM, PITCH, GREEN, FPBGA-208 208 unknown 3A991.B.2.A 8542.32.00.41
70T633S12BF8
 Renesas Electronics Corporation 		Check for Price No No Obsolete 9.4372 Mbit 18 512KX18 2.5 V 12 ns MULTI-PORT SRAM COMMON 1 2 512000 524.288 k ASYNCHRONOUS 3-STATE PARALLEL 10 mA 2.4 V 355 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.5 mm 15 mm 15 mm RENESAS ELECTRONICS CORP CABGA 208 BF208 not_compliant NLR 8542320041 Renesas Electronics
IDT70T633S12BFI
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 18 512KX18 2.5 V 12 ns MULTI-PORT SRAM COMMON 1 2 512000 524.288 k ASYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 395 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.5 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LFBGA, BGA208,17X17,32 208 not_compliant 3A991.B.2.A 8542.32.00.41
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