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W3J512M32G-1066BC
Microsemi Corporation
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Check for Price | No | Obsolete | 17.1799 Gbit | 32 | 512MX32 | 1.5 V | 300 ps | 533 MHz | 8192 | SINGLE BANK PAGE BURST | DDR3 DRAM | AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED | COMMON | 8 | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 8 | 72 mA | 760 µA | 1.575 V | 1.425 V | CMOS | COMMERCIAL | R-PBGA-B136 | Not Qualified | 70 °C | 136 | PLASTIC/EPOXY | FBGA | BGA136,12X17,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 3.84 mm | 14.6 mm | 10.1 mm | MICROSEMI CORP | 10 X 14.50 MM, 0.80 MM PITCH, PLASTIC, BGA-136 | unknown | EAR99 | 8542.32.00.36 | |||||||||
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W3J512M32G-1333BI
Microsemi Corporation
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Check for Price | No | Obsolete | 17.1799 Gbit | 32 | 512MX32 | 1.5 V | 255 ps | 667 MHz | 8192 | SINGLE BANK PAGE BURST | DDR3 DRAM | AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED | COMMON | 8 | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 8 | 72 mA | 880 µA | 1.575 V | 1.425 V | CMOS | INDUSTRIAL | R-PBGA-B136 | Not Qualified | 85 °C | -40 °C | 136 | PLASTIC/EPOXY | FBGA | BGA136,12X17,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 3.84 mm | 14.6 mm | 10.1 mm | MICROSEMI CORP | 10 X 14.50 MM, 0.80 MM PITCH, PLASTIC, BGA-136 | unknown | EAR99 | 8542.32.00.36 | ||||||||
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IS46TR16K01S2A-15HBLA1
Integrated Silicon Solution Inc
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Check for Price | Active | 17.1799 Gbit | 16 | 1GX16 | 1.5 V | DUAL BANK PAGE BURST | DDR3 DRAM | AUTO/SELF REFRESH | 1 | 1 | 1000000000 | 1.0737 G | SYNCHRONOUS | YES | 1.575 V | 1.425 V | CMOS | INDUSTRIAL | R-PBGA-B96 | 95 °C | -40 °C | 96 | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.4 mm | 14 mm | 10 mm | INTEGRATED SILICON SOLUTION INC | LFBGA, | compliant | EAR99 | 8542.32.00.36 | 2018-07-17 | |||||||||||||||||||
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IS46TR16K01S2A-125KBLA2
Integrated Silicon Solution Inc
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Check for Price | Active | 17.1799 Gbit | 16 | 1GX16 | 1.5 V | DUAL BANK PAGE BURST | DDR3 DRAM | AUTO/SELF REFRESH | 1 | 1 | 1000000000 | 1.0737 G | SYNCHRONOUS | YES | 1.575 V | 1.425 V | CMOS | INDUSTRIAL | R-PBGA-B96 | 105 °C | -40 °C | 96 | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.4 mm | 14 mm | 10 mm | INTEGRATED SILICON SOLUTION INC | LFBGA, | compliant | EAR99 | 8542.32.00.36 | 2018-07-17 | |||||||||||||||||||
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W3J512M32GT-1333B3M
Mercury Systems Inc
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Check for Price | Active | 17.1799 Gbit | 32 | 512MX32 | 1.5 V | SINGLE BANK PAGE BURST | DDR3 DRAM | AUTO/SELF REFRESH | 8 | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | YES | 8 | CMOS | R-PBGA-B204 | 125 °C | -55 °C | 204 | PLASTIC/EPOXY | RECTANGULAR | YES | BALL | BOTTOM | MERCURY SYSTEMS INC | , | unknown | EAR99 | 8542.32.00.36 | |||||||||||||||||||||||||||
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W3J512M32G-1600B3M
Mercury Systems Inc
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Check for Price | Active | 17.1799 Gbit | 32 | 512MX32 | 1.5 V | SINGLE BANK PAGE BURST | DDR3 DRAM | AUTO/SELF REFRESH | 8 | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | NO | YES | 8 | CMOS | MILITARY | R-PBGA-B136 | 125 °C | -55 °C | 136 | PLASTIC/EPOXY | BGA | BGA136(UNSPEC) | RECTANGULAR | GRID ARRAY | YES | BALL | BOTTOM | MERCURY SYSTEMS INC | BGA, BGA136(UNSPEC) | unknown | EAR99 | 8542.32.00.36 | ||||||||||||||||||||||
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W3J512M32G-800B3I
Mercury Systems Inc
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Check for Price | Active | 17.1799 Gbit | 32 | 512MX32 | 1.5 V | SINGLE BANK PAGE BURST | DDR3 DRAM | AUTO/SELF REFRESH | 8 | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | NO | YES | 8 | CMOS | INDUSTRIAL | R-PBGA-B136 | 85 °C | -40 °C | 136 | PLASTIC/EPOXY | BGA | BGA136(UNSPEC) | RECTANGULAR | GRID ARRAY | YES | BALL | BOTTOM | MERCURY SYSTEMS INC | BGA, BGA136(UNSPEC) | unknown | EAR99 | 8542.32.00.36 | ||||||||||||||||||||||
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W3J512M32GT-1333B2M
Microsemi Corporation
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Check for Price | No | Obsolete | 17.1799 Gbit | 32 | 512MX32 | 1.5 V | 255 ps | 667 MHz | 8192 | SINGLE BANK PAGE BURST | DDR3 DRAM | AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED | COMMON | 8 | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 8 | 72 mA | 880 µA | 1.575 V | 1.425 V | CMOS | MILITARY | R-PBGA-B204 | Not Qualified | 125 °C | -55 °C | 204 | PLASTIC/EPOXY | FBGA | BGA204,12X17,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 3.84 mm | 14.6 mm | 10.1 mm | MICROSEMI CORP | 10 X 14.50 MM, 0.80 MM PITCH, PLASTIC, BGA-204 | unknown | EAR99 | 8542.32.00.36 | ||||||||
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W3J512M32GT-1066B3C
Mercury Systems Inc
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Check for Price | Active | 17.1799 Gbit | 32 | 512MX32 | 1.5 V | SINGLE BANK PAGE BURST | DDR3 DRAM | AUTO/SELF REFRESH | 8 | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | YES | 8 | CMOS | R-PBGA-B204 | 70 °C | 204 | PLASTIC/EPOXY | RECTANGULAR | YES | BALL | BOTTOM | MERCURY SYSTEMS INC | , | unknown | EAR99 | 8542.32.00.36 | ||||||||||||||||||||||||||||
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MT8KTF25664AZ-1G6XX
Micron Technology Inc
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Check for Price | Active | 17.1799 Gbit | 64 | 256MX64 | 1.35 V | SINGLE BANK PAGE BURST | DDR3 DRAM | AUTO/SELF REFRESH | 1 | 1 | 256000000 | 268.4355 M | SYNCHRONOUS | YES | 1.45 V | 1.283 V | CMOS | COMMERCIAL | R-XDMA-N240 | e4 | 70 °C | 240 | UNSPECIFIED | DIMM | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | GOLD | NO LEAD | 1 mm | DUAL | 30.5 mm | 133.35 mm | MICRON TECHNOLOGY INC | DIMM, | compliant | EAR99 | 8542.32.00.36 | DIMM | 240 |