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Manufacturer Part Number: 24lc256test
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24LC256T-E/STRVE
 Microchip Technology Inc 		Check for Price Active 262.144 kbit 8 32KX8 4.5 V 400 kHz EEPROM 200 1000000 Write/Erase Cycles 1010DDDR 1 1 32000 32.768 k SYNCHRONOUS OPEN-DRAIN SERIAL 4.5 V I2C 5 µA 3 µA 5.5 V 2.5 V CMOS AUTOMOTIVE 5 ms HARDWARE R-PDSO-G8 e3 1 125 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 1.2 mm 4.4 mm 3 mm MICROCHIP TECHNOLOGY INC TSSOP-8 compliant EAR99 8542.32.00.51 Microchip
24LC256T-E/ST16KVAO
 Microchip Technology Inc 		Check for Price Yes Active 262.144 kbit 8 32KX8 4.5 V 400 kHz EEPROM 200 1000000 Write/Erase Cycles 1010DDDR 1 1 32000 32.768 k SYNCHRONOUS OPEN-DRAIN SERIAL 4.5 V NO I2C 5 µA 3 µA 5.5 V 2.5 V CMOS AUTOMOTIVE 5 ms HARDWARE R-PDSO-G8 125 °C -40 °C AEC-Q100 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES GULL WING 650 µm DUAL 1.2 mm 4.4 mm 3 mm MICROCHIP TECHNOLOGY INC TSSOP-8 compliant EAR99 8542.32.00.51
24LC256T-E/ST
 Microchip Technology Inc 		Check for Price Yes Yes Active 262.144 kbit 8 32KX8 4.5 V 400 kHz EEPROM 200 1000000 Write/Erase Cycles 1010DDDR 1 1 32000 32.768 k SYNCHRONOUS OPEN-DRAIN SERIAL 4.5 V NO I2C 5 µA 3 µA 5.5 V 2.5 V CMOS AUTOMOTIVE 5 ms HARDWARE R-PDSO-G8 Not Qualified e3 1 125 °C -40 °C 260 AEC-Q100 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 1.2 mm 4.4 mm 3 mm MICROCHIP TECHNOLOGY INC TSSOP-8 compliant EAR99 8542.32.00.51 Microchip SOIC 8
24LC256T-E/ST14G
 Microchip Technology Inc 		Check for Price Yes Yes Obsolete 262.144 kbit 8 32KX8 3 V 400 kHz EEPROM DATA RETENTION > 200 YEARS; 1,000,000 ERASE/WRITE CYCLES 200 1000000 Write/Erase Cycles 1010DDDR 1 32000 32.768 k SYNCHRONOUS SERIAL I2C 5 µA 3 µA 5.5 V 2.5 V CMOS AUTOMOTIVE 5 ms HARDWARE R-PDSO-G14 Not Qualified e3 1 125 °C -40 °C 260 14 PLASTIC/EPOXY TSSOP TSSOP14,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 1.1 mm 5 mm 4.4 mm MICROCHIP TECHNOLOGY INC 4.40 MM, LEAD FREE, PLASTIC, MO-153, TSSOP-14 compliant EAR99 8542.32.00.51 TSSOP 14
24LC256T-E/ST14
 Microchip Technology Inc 		Check for Price Yes Yes Obsolete 262.144 kbit 8 32KX8 3 V 400 kHz EEPROM DATA RETENTION > 200 YEARS; 1,000,000 ERASE/WRITE CYCLES 200 1000000 Write/Erase Cycles 1010DDDR 1 32000 32.768 k SYNCHRONOUS SERIAL I2C 5 µA 3 µA 5.5 V 2.5 V CMOS AUTOMOTIVE 5 ms HARDWARE R-PDSO-G14 Not Qualified e3 1 125 °C -40 °C 260 14 PLASTIC/EPOXY TSSOP TSSOP14,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 1.1 mm 5 mm 4.4 mm MICROCHIP TECHNOLOGY INC 4.40 MM, LEAD FREE, PLASTIC, MO-153, TSSOP-14 compliant EAR99 8542.32.00.51 TSSOP 14
24LC256T-E/STG
 Microchip Technology Inc 		Check for Price Yes Yes Obsolete 262.144 kbit 8 32KX8 4.5 V 400 kHz EEPROM DATA RETENTION > 200 YEARS; 1,000,000 ERASE/WRITE CYCLES 200 1000000 Write/Erase Cycles 1010DDDR 1 32000 32.768 k SYNCHRONOUS SERIAL I2C 5 µA 3 µA 5.5 V 2.5 V CMOS AUTOMOTIVE 5 ms HARDWARE R-PDSO-G8 Not Qualified e3 1 125 °C -40 °C 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 1.2 mm 4.4 mm 3 mm MICROCHIP TECHNOLOGY INC 4.40 MM, PLASTIC, TSSOP-8 compliant EAR99 8542.32.00.51 SOIC 8