Parametric results for: 24LC04B I-P under EEPROMs

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Manufacturer Part Number: 24lc04b
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24LC04BHT-I/MNY
Microchip Technology Inc
$0.2077 Yes Active 4.096 kbit 8 512X8 5 V 400 kHz EEPROM YES 200 1000000 Write/Erase Cycles 1010XXMR 1 1 512 512 words SYNCHRONOUS OPEN-DRAIN 16 words SERIAL 5 V I2C 5 µA 3 µA 5.5 V 2.5 V CMOS INDUSTRIAL 5 ms HARDWARE R-PDSO-N8 Not Qualified e4 1 85 °C -40 °C 260 40 8 PLASTIC/EPOXY HVSON SOLCC8,.11,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES Nickel/Palladium/Gold (Ni/Pd/Au) NO LEAD 500 µm DUAL 800 µm 3 mm 2 mm MICROCHIP TECHNOLOGY INC DFN TDFN-8 8 compliant EAR99 8542.32.00.51 Microchip
24LC04BT-I/SN
Microchip Technology Inc
$0.2078 Yes Yes Active 4.096 kbit 8 512X8 5 V 400 kHz EEPROM 200 1000000 Write/Erase Cycles 1010XXMR 1 1 512 512 words SYNCHRONOUS OPEN-DRAIN SERIAL 5 V I2C 1 µA 3 µA 5.5 V 2.5 V CMOS 5 ms HARDWARE R-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 260 30 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm MICROCHIP TECHNOLOGY INC SOIC 8 compliant EAR99 8542.32.00.51 Microchip 1991-01-01
24LC04BT/SN
Microchip Technology Inc
$0.2311 Yes Yes Active 4.096 kbit 8 512X8 5 V 400 kHz EEPROM 200 1000000 Write/Erase Cycles 1010XXMR 1 1 512 512 words SYNCHRONOUS OPEN-DRAIN SERIAL 5 V I2C 3 µA 5.5 V 2.5 V CMOS COMMERCIAL 5 ms HARDWARE R-PDSO-G8 Not Qualified e3 1 70 °C 260 TS 16949 30 8 PLASTIC/EPOXY SOP SOP8,.23 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm MICROCHIP TECHNOLOGY INC SOIC 0.150 INCH, PLASTIC, SOIC-8 8 compliant EAR99 8542.32.00.51 Microchip
24LC04BT-E/OT
Microchip Technology Inc
$0.2312 Yes Yes Active 4.096 kbit 8 512X8 5 V 400 kHz EEPROM 200 1000000 Write/Erase Cycles 1010XXMR 1 1 512 512 words SYNCHRONOUS OPEN-DRAIN SERIAL 5 V I2C 5 µA 3 µA 5.5 V 2.5 V CMOS 5 ms HARDWARE R-PDSO-G5 Not Qualified e3 1 125 °C -40 °C 260 5 PLASTIC/EPOXY LSSOP TSOP5,.11,37 RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 950 µm DUAL 1.45 mm 2.9 mm 1.6 mm MICROCHIP TECHNOLOGY INC SOT-23 SOT-23, 5 PIN 5 compliant EAR99 8542.32.00.51 Microchip 1991-01-01
24LC04B/SN
Microchip Technology Inc
$0.2448 Yes Yes Active 4.096 kbit 8 512X8 5 V 400 kHz EEPROM 200 1000000 Write/Erase Cycles 1010XXMR 1 1 512 512 words SYNCHRONOUS OPEN-DRAIN SERIAL 5 V I2C 100 µA 3 µA 5.5 V 4.5 V CMOS COMMERCIAL 5 ms HARDWARE R-PDSO-G8 Not Qualified e3 1 70 °C 260 30 8 PLASTIC/EPOXY SOP SOP8,.23 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm MICROCHIP TECHNOLOGY INC SOIC 0.150 INCH, PLASTIC, SOIC-8 8 compliant EAR99 8542.32.00.51 Microchip
24LC04BT-I/ST
Microchip Technology Inc
$0.2486 Yes Yes Active 4.096 kbit 8 512X8 5 V 400 kHz EEPROM 200 1000000 Write/Erase Cycles 1010XXMR 1 1 512 512 words SYNCHRONOUS OPEN-DRAIN SERIAL 5 V I2C 1 µA 3 µA 5.5 V 2.5 V CMOS 5 ms HARDWARE R-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 260 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES Matte Tin (Sn) GULL WING 650 µm DUAL 1.2 mm 4.4 mm 3 mm MICROCHIP TECHNOLOGY INC SOIC 8 compliant EAR99 8542.32.00.51 Microchip 1991-01-01
24LC04BT-I/OT
Microchip Technology Inc
$0.2829 Yes Yes Active 4.096 kbit 8 512X8 5 V 400 kHz EEPROM 200 1000000 Write/Erase Cycles 1010XXMR 1 1 512 512 words SYNCHRONOUS OPEN-DRAIN SERIAL 5 V I2C 1 µA 3 µA 5.5 V 2.5 V CMOS 5 ms HARDWARE R-PDSO-G5 Not Qualified e3 1 85 °C -40 °C 260 5 PLASTIC/EPOXY LSSOP TSOP5,.11,37 RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 950 µm DUAL 1.45 mm 2.9 mm 1.6 mm MICROCHIP TECHNOLOGY INC SOT-23 SOT-23, 5 PIN 5 compliant EAR99 8542.32.00.51 Microchip 1991-01-01
24LC04BT-I/MNY
Microchip Technology Inc
$0.2836 Yes Yes Active 4.096 kbit 8 512X8 5 V 400 kHz EEPROM 200 1000000 Write/Erase Cycles 1010XXMR 1 1 512 512 words SYNCHRONOUS OPEN-DRAIN SERIAL 5 V I2C 1 µA 3 µA 5.5 V 2.5 V CMOS 5 ms HARDWARE R-PDSO-N8 Not Qualified e4 1 85 °C -40 °C 260 40 8 PLASTIC/EPOXY HVSON SOLCC8,.11,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES Nickel/Palladium/Gold (Ni/Pd/Au) NO LEAD 500 µm DUAL 800 µm 3 mm 2 mm MICROCHIP TECHNOLOGY INC DFN TDFN-8 8 compliant EAR99 8542.32.00.51 Microchip 1991-01-01
24LC04B/ST
Microchip Technology Inc
$0.2843 Yes Yes Active 4.096 kbit 8 512X8 5 V 400 kHz EEPROM 200 1000000 Write/Erase Cycles 1010XXMR 1 1 512 512 words SYNCHRONOUS OPEN-DRAIN SERIAL 5 V I2C 100 µA 3 µA 5.5 V 4.5 V CMOS COMMERCIAL 5 ms HARDWARE R-PDSO-G8 Not Qualified e3 1 70 °C 260 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 1.2 mm 4.4 mm 3 mm MICROCHIP TECHNOLOGY INC SOIC 4.40 MM, PLASTIC, TSSOP-8 8 compliant EAR99 8542.32.00.51 Microchip
24LC04B-E/SN
Microchip Technology Inc
$0.2908 Yes Yes Active 4.096 kbit 8 512X8 5 V 400 kHz EEPROM 200 1000000 Write/Erase Cycles 1010XXMR 1 1 512 512 words SYNCHRONOUS OPEN-DRAIN SERIAL 5 V I2C 5 µA 3 µA 5.5 V 2.5 V CMOS 5 ms HARDWARE R-PDSO-G8 Not Qualified e3 1 125 °C -40 °C 260 30 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm MICROCHIP TECHNOLOGY INC SOIC SOIC-8 8 compliant EAR99 8542.32.00.51 Microchip 1991-01-01