Parametric results for: 香港USDT兑换(tg：@hkotccc)St95 under Other Telecom ICs

All Filters Additional Feature Clock Frequency-Max (fCLK) Data Retention Time-Min Endurance JESD-30 Code JESD-609 Code Length Manufacturer Memory Density Memory IC Type Memory Width Moisture Sensitivity Level Mounting Feature Number of Functions Number of Terminals Number of Words Number of Words Code Operating Mode Operating Temperature-Max Operating Temperature-Min Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style Supply Voltage-Nom (Vsup)

1 MILLION ERASE/WRITE CYCLES; 40 YEARS DATA RETENTION; 16 BYTE PAGE WRITE 9 1 MILLION ERASE/WRITE CYCLES; 40 YEARS DATA RETENTION; SPI BUS INTERFACE; 16 BYTE PAGE WRITE 9 1 MILLION ERASE/WRITE CYCLES; 40 YEARS DATA RETENTION; SPI BUS SERIAL INTERFACE; 16 BYTE PAGE WRITE 9 100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SPI BUS INTERFACE; 16 BYTE PAGE WRITE 12 100000 ERASE/WRITE CYCLES; 40 YEARS DATA RETENTION; SPI BUS INTERFACE; 16 BYTE PAGE WRITE 1 1000K ERASE/WRITE CYCLES MIN.; DATA RETENTION > 10 YEARS 8

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Clock Frequency-Max (fCLK) (3)

1 MHz 59 2 MHz 93 2.1 MHz 1

Min (MHz) - Max (MHz)

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10 55 40 92 100 1

Min - Max

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100000.0 Write/Erase Cycles 12 1000000.0 Write/Erase Cycles 119

Min (Write/EraseCycles) - Max (Write/EraseCycles)

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R-PDIP-T28 1 R-PDIP-T8 73 R-PDSO-G28 1 R-PDSO-G8 105 S-PQCC-J44 1 S-PQFP-G32 2 S-XQCC-N32 1

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e0 90 e4 48

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4.9 mm 85 5 mm 1 5.3 mm 4 7 mm 1 9.55 mm 64 25.6 mm 1

Min (mm) - Max (mm)

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Manufacturer (3)

ST-Semiconductors Of Indiana Inc 1 STMicroelectronics 191 Vishay Intertechnologies 1

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Memory Density (4)

1.024 kbit 35 2.048 kbit 52 4.096 kbit 58 8.192 kbit 33

Min (bit) - Max (bit)

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EEPROM 178

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Memory Width (1)

8 178

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1 4

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THROUGH HOLE MOUNT 1

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1.0 155

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2 1 28 2 32 3 44 1 8 178

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128 words 35 256 words 52 512 words 58 1.024 k 33

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128.0 35 256.0 52 512.0 58 1000.0 33

Min - Max

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SYNCHRONOUS 153

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70.0 °C 64 85.0 °C 69 125.0 °C 52

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-55.0 °C 1 -40.0 °C 119 -25.0 °C 1 0.0 °C 64

Min (°C) - Max (°C)

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Organization (4)

128X8 35 1KX8 33 256X8 52 512X8 58

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3-STATE 113

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PLASTIC/EPOXY 183 UNSPECIFIED 1

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DIP 74 HVQCCN 1 LQFP 1 QCCJ 1 QFP 1 SOP 106

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DIP28,.6 1 DIP8,.3 53 LDCC44,.7SQ 1 QFP32,.35SQ,32 2 SOP28,.4 1 SOP8,.25 78

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CYLINDRICAL PACKAGE 1 RECTANGULAR 180 SQUARE 4

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Axial 1 CHIP CARRIER 1 CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE 1 FLATPACK 1 FLATPACK, LOW PROFILE 1 IN-LINE 74 SMALL OUTLINE 106

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Supply Voltage-Nom (Vsup) (2)

3.3 V 24 5 V 136

Min (V) - Max (V)

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