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AP2280-1FMG-7
Diodes Incorporated
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$0.4394 | Yes | Yes | Active | 1.8 V | 1 | POWER SUPPLY SUPPORT CIRCUIT | 1 | R-PDSO-N6 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | HVSON | SOLCC6,.07,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 1.8125 mm | 2.0125 mm | 605 µm | DIODES INC | DFN | HVSON, | 6 | compliant | EAR99 | 8542.39.00.01 | Diodes Incorporated | NO | 6 V | 1.5 V | |||||||||
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BGSA14GN10E6327XTSA1
Infineon Technologies AG
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$0.4462 | Yes | Yes | Active | 2.85 V | TELECOM CIRCUIT | 1 | OTHER | R-XBCC-B10 | 1 | 85 °C | -30 °C | 10 | UNSPECIFIED | BCC | RECTANGULAR | CHIP CARRIER | YES | BUTT | 400 µm | BOTTOM | 1.1 mm | 1.5 mm | 400 µm | INFINEON TECHNOLOGIES AG | BCC, | compliant | 8542.39.00.01 | Infineon | |||||||||||||||||||
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BGS12PN10E6327XTSA1
Infineon Technologies AG
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$0.4477 | Yes | Yes | Active | 2.85 V | CMOS | TELECOM CIRCUIT | 1 | OTHER | R-PBCC-N10 | 1 | 85 °C | -30 °C | 10 | PLASTIC/EPOXY | VQCCN | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | YES | NO LEAD | 400 µm | BOTTOM | 1.1 mm | 1.5 mm | 400 µm | INFINEON TECHNOLOGIES AG | VQCCN, | compliant | 8542.39.00.01 | Infineon | ||||||||||||||||||
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BGS16MN14E6327XTSA1
Infineon Technologies AG
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$0.4499 | Yes | Obsolete | 3.5 V | CMOS | TELECOM CIRCUIT | 1 | OTHER | S-PQCC-N14 | e3 | 1 | 85 °C | -30 °C | 14 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Tin (Sn) | NO LEAD | 500 µm | QUAD | 2 mm | 2 mm | 770 µm | INFINEON TECHNOLOGIES AG | 2 X 2 MM, GREEN, PLASTIC, TSNP-14 | compliant | 8542.39.00.01 | Infineon | |||||||||||||||||
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BGA5H1BN6E6327XTSA1
Infineon Technologies AG
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$0.4673 | Yes | Active | 1.8 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XBCC-B6 | 1 | 85 °C | -40 °C | 6 | UNSPECIFIED | BCC | RECTANGULAR | CHIP CARRIER | YES | BUTT | 400 µm | BOTTOM | 700 µm | 1.1 mm | 400 µm | INFINEON TECHNOLOGIES AG | BCC, | compliant | 8542.39.00.01 | Infineon | 2018-04-13 | |||||||||||||||||||
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ATA5577M2330C-DBQ
Microchip Technology Inc
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$0.5035 | Yes | Active | 3.6 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XUUC-N2 | Not Qualified | 85 °C | -40 °C | 2 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | NO | NO LEAD | UPPER | MICROCHIP TECHNOLOGY INC | DIE | compliant | 5A991.G | 8523.59.00.00 | Microchip | ||||||||||||||||||||||
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ATA5577M3330C-DBQ
Microchip Technology Inc
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$0.5035 | Active | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XUUC-N2 | 85 °C | -40 °C | 2 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | YES | UNSPECIFIED | 524 µm | UPPER | 1 mm | 1.35 mm | 312 µm | MICROCHIP TECHNOLOGY INC | DIE | compliant | 5A991.G | 8523.59.00.00 | Microchip | |||||||||||||||||||||
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ATA5577M233SC-DBQ
Microchip Technology Inc
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$0.5035 | Yes | Active | 3.6 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XUUC-N2 | 85 °C | -40 °C | 2 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | NO | NO LEAD | UPPER | MICROCHIP TECHNOLOGY INC | , DIE OR CHIP | compliant | 5A991.G | 8523.59.00.00 | Microchip | 2020-02-13 | ||||||||||||||||||||||
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BGA8V1BN6E6327XTSA1
Infineon Technologies AG
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$0.5301 | Yes | Active | 2.8 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-N6 | 1 | 85 °C | -40 °C | 6 | PLASTIC/EPOXY | VSON | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | YES | NO LEAD | 400 µm | DUAL | 700 µm | 1.1 mm | 400 µm | INFINEON TECHNOLOGIES AG | TSNP-6 | compliant | 8542.39.00.01 | Infineon | ||||||||||||||||||||
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BGS14PN10E6327XTSA1
Infineon Technologies AG
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$0.5621 | Yes | Yes | Active | 2.85 V | CMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XQCC-N10 | 1 | 85 °C | -40 °C | 10 | UNSPECIFIED | VQCCN | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | YES | NO LEAD | 400 µm | QUAD | 1.1 mm | 1.5 mm | 400 µm | INFINEON TECHNOLOGIES AG | VQCCN, | compliant | 8542.39.00.01 | Infineon |